
Gently take one of the NE5532 ICs in the tweezers. Place it on the PCB close to IC1 location,
ensuring that you know which side has pin 1. Orient the IC so that it's ready to slide into place.
Place the tip of the soldering iron on the outside edge of the soldered pad, so that the solder melts.
Quickly slide the IC into place, ensuring that the IC's other legs are sat squarely on the other pads.
Remove the soldering iron as quickly as you can to avoid overheating the IC. If the IC isn't quite sat
squarely on the pads, re-apply the soldering iron to the soldered pad, & gently nudge the IC into
place with the tweezers. Again, try to minimise the time that the IC is being heated up. If you've
used it, the stickiness of the flux will help hold the IC in place. Don't worry too much about the
soldering itself on this joint right now, we're really aiming to hold the device in place with this joint
right now. We can redo this later once the other pins are soldered. The important thing right now is
that the IC pins are precisely aligned on the PCB pads.
MTM SimpleEQ 1206 build doc v1.3
Page 21
Illustration 27: IC1 pads showing the pad of pin 8 pre-soldered