Texas Instruments WL1835MODCOM8B, Руководство пользователя

Страница: 16 / 25

Circuit Design
www.ti.com
16 SWRU359E – September 2013 – Revised September 2015
Submit Documentation Feedback
Copyright © 2013–2015, Texas Instruments Incorporated
WL1835MODCOM8B WLAN MIMO and Bluetooth
®
Module EVM
7.2 Bill of Materials (BOM)
Table 2 lists the bill of materials.
Table 2. BOM
1 TI WL1835 Wi-Fi/ Bluetooth Module WL18MODGB U1
2 XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm 7XZ3200005 OSC1
3 ANT / Chip / 2.4 GHz, 5 GHz / Peak Gain >5 dBi ANT016008LCD2442MA1 ANT1, ANT2
4 CON Male 1x2 / Pitch P301-SGP-040/028-02 J1, J3, J4
5 DC JUMPER / PITCH 2.0 mm CMJ-20BB J1, J3
6 Mini RF Header Receptacle U.FL-R-SMT-1(10) J5, J6
7 IND 0402 / 1.1 nH / ±0.05 nH / SMD LQP15MN1N1W02 L1
8 IND 0402 / 1.5 nH / ±0.05 nH / SMD LQP15MN1N5W02 L2
9 CAP 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H1R2BB01 C11
10 CAP 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H2R2BB01 C9
11 CAP 0402 / 4 pF / 50 V / C0G / ±0.1 pF GJM1555C1H4R0BB01 C14
12 CAP 0402 / 8 pF / 50 V / C0G / ±0.1 pF GJM1555C1H8R0BB01 C13
13 CAP 0402 / 10 pF / 50 V / NPO / ±5% 0402N100J500LT C7, C8
14 CAP 0402 / 0.1 µF / 6.3 V / X7R / ±10% 0402B104K100CT C3, C4
15 CAP 0402 / 1 µF / 6.3 V / X5R / ±10% / HF GRM155R60J105KE19D C1
16 CAP 0603 / 10 µF / 6.3 V / X5R / ±20% C1608X5R0J106M C2
17 RES 0402 / 0R / ±5% WR04X000 PTL
R1, R2, R3, R4, R5, R6, R7, R8, R9,
R10, R11, R12, R13, R14, R15,
R16, R17, R18, R19, R21, R22,
R23, R24, R25, R26, R27, R28,
R29, R30, R31, R32
18 RES 0402 / 10K / ±5% WR04X103 JTL R20