Layout Guidelines
18
SWRU359E – September 2013 – Revised September 2015
Copyright © 2013–2015, Texas Instruments Incorporated
WL1835MODCOM8B WLAN MIMO and Bluetooth
®
Module EVM
Figure 16. Layer 3
Figure 17. Layer 4
Table 3. Module Layout Guidelines
Reference
Guideline Description
1
The proximity of ground vias must be close to the pad.
2
Signal traces must not be run underneath the module on the layer where the module is mounted.
3
Have a complete ground pour in layer 2 for thermal dissipation.
4
Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5
Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if
possible.
6
Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting
layer.
