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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.

Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP® Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2012, Texas Instruments Incorporated

Содержание WCSP-Packaged bq24272

Страница 1: ...ommended Test Equipment Setup 9 2 4 Recommended Test Procedure 12 3 Printed Circuit Board Layout Guideline 13 4 Bill of Materials and Board Layout 14 4 1 Bill of Materials 14 4 2 Board Layout 16 List of Figures 1 bq24272 273EVM HPA759 Schematic Sheet 1 of 2 3 2 bq24272 273EVM HPA759 Schematic Sheet 2 of 2 4 3 BAT_Load PR1010 Schematic 8 4 Connections of HPA172 Kit 9 5 Original Test Setup for bq242...

Страница 2: ...9 SLUSB08 1 2 bq24272 273 EVM Features The bq24272 273 evaluation module EVM is a complete charger module for evaluating compact flexible high efficiency switch mode battery charge and power path management solution for single cell Li ion and Li polymer battery powered systems used in a wide range of portable applications Key EVM features include 76 2 mm 76 2 mm 1 2 mm footprint for entire solutio...

Страница 3: ...duction 1 3 Schematic Figure 1 bq24272 273EVM HPA759 Schematic Sheet 1 of 2 3 SLUU916 April 2012 WCSP Packaged bq24272 273 Evaluation Modules Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 4: ...ain the suffix X may have been assembled with incorrectly marked ICs Regardless of the IC s marking the EVM was assembled with the correct part number as specified in the EVM bill of material 4 WCSP Packaged bq24272 273 Evaluation Modules SLUU916 April 2012 Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 5: ...negative header bq24272 only J9 BAT Battery positive header J10 BAT Battery positive terminal J10 GND Battery negative terminal J11 GND Battery negative header J12 DRV DRV reference voltage positive header J13 DRV DRV reference voltage positive terminal J13 GND DRV reference voltage negative terminal J14 GND DRV reference voltage negative header 1 5 Test Points Test Point Description TP1 Kelvin to...

Страница 6: ...Connects the TS pin to an external thermistor The resistor divider formed by R1 and R3 has been sized to accommodate a 10 kΩ thermistor If a different thermistor is used R1 and R3 must be resized 1 7 Recommended Operating Conditions Min Typ Max Unit Supply voltage VIN Input voltage from ac adapter 4 2 10 V System voltage VSYS Voltage output at SYS terminal bq24272 only depends on 3 4 VBATR V VBAT ...

Страница 7: ...ge across point XXX and YYY I JXX YYY Current going out from the YYY terminal of header XX Jxx BBB Terminal or pin BBB of header xx JPx ON Internal jumper Jxx terminals are shorted JPx OFF Internal jumper Jxx terminals are open JPx YY ON Internal jumper Jxx adjacent terminals marked as YY are shorted Measure A B Check specified parameters A B If measured values are not within specified limits the ...

Страница 8: ...y when connected to a power supply Figure 3 BAT_Load PR1010 Schematic 2 2 3 Load 2 Between SYS and GND Although not required a resistive load capable of sinking up to 3 A can be used 2 2 4 Meters Four equivalent voltage meters VM and two equivalent current meters CM are required The current meters must be able to measure 4 A current 2 2 5 Computer A computer with at least one USB port and a USB ca...

Страница 9: ... status Alternatively the AutoRead function can be activated periodically updating the GUI with the IC s status 2 3 Recommended Test Equipment Setup 1 For all power connections use short twisted pair wires of appropriate gauge wire for the amount of the current 2 Set PS 1 for 6 V 3 A current limit and then turn the supply off 3 If BAT_Load as shown in Figure 1 is used connect PS 2 set to approxima...

Страница 10: ...PIO Test Summary www ti com 10 After the preceding steps have been performed the test setup for HPA759 is configured as shown in Figure 5 Figure 5 Original Test Setup for bq24272 273EVM HPA759 10 WCSP Packaged bq24272 273 Evaluation Modules SLUU916 April 2012 Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 11: ...click IN DEVICE when prompted at start up The main window of the software is shown in Figure 6 Figure 6 Main Window of bq2427xSW Evaluation Software 11 SLUU916 April 2012 WCSP Packaged bq24272 273 Evaluation Modules Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 12: ... the Section 2 3 steps are followed 2 Connect the output of PS 1 in series with current meter multimeter 1 CM 1 to J1 and J3 or J2 IN GND 3 Connect voltage meter 1 VM 1 across J1 or TP1 and J3 IN GND 4 Move JP2 to HI 5 Turn on PS 1 and PS 2 if used 6 Return JP2 to LO 7 Software setup Press the READ button to obtain the current settings Set Write On Change to ON if not already set Set Reset Watchdo...

Страница 13: ...apacitors close to their respective IC pins and as close as possible to PGND do not place components such that routing interrupts power stage currents All small control signals must be routed away from the high current paths 5 The PCB must have a ground plane return connected directly to the return of all components through vias two vias per capacitor for power stage capacitors one via per capacit...

Страница 14: ... J13 ED555 2DS Terminal block 2 pin 6 A 3 5 mm 0 27 0 25 ED555 2DS OST 2 0 J4 J8 PEC02SAAN Header 2 pin 100 mil spacing 0 100 2 PEC02SAAN Sullins 1 1 J5 N2510 6002 RB Connector male straight 2 5 pin 100 mil spacing 4 wall 0 338 0 788 in N2510 6002 RB 3M 1 0 J6 ED555 2DS Terminal block 2 pin 6 A 3 5 mm 0 27 0 25 ED555 2DS OST 1 0 JP1 PEC03SAAN Header male 3 pin 100 mil spacing 0 100 in 3 PEC03SAAN ...

Страница 15: ...P10 5002 Test point white thru hole color keyed 0 100 0 100 in 5002 Keystone 4 4 TP11 TP12 5002 Test point white thru hole color keyed 0 100 0 100 in 5002 Keystone TP13 TP14 1 0 U1 BQ24272RGE IC 2 5 A single input single cell switchmode Li Ion battery charger QFN 24 BQ24272RGE TI with power path management 0 1 U1 BQ24273RGE IC 2 5 A single input single cell switchmode Li Ion battery charger QFN 24...

Страница 16: ...rd Layout www ti com 4 2 Board Layout Figure 7 Top Assembly Layer Figure 8 Top Layer 16 WCSP Packaged bq24272 273 Evaluation Modules SLUU916 April 2012 Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 17: ...ials and Board Layout Figure 9 First Internal Layer Figure 10 Second Internal Layer 17 SLUU916 April 2012 WCSP Packaged bq24272 273 Evaluation Modules Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 18: ...of Materials and Board Layout www ti com Figure 11 Bottom Layer 18 WCSP Packaged bq24272 273 Evaluation Modules SLUU916 April 2012 Submit Documentation Feedback Copyright 2012 Texas Instruments Incorporated ...

Страница 19: ...ency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause interference with radio communications in which case the user at his own expense will be required to take whatever measures may be required t...

Страница 20: ... its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this l...

Страница 21: ...er you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do not transfer this product unless you give the same notice above to the transferee Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shi...

Страница 22: ... property damage personal injury or death If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Plea...

Страница 23: ...ency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause interference with radio communications in which case the user at his own expense will be required to take whatever measures may be required t...

Страница 24: ... its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this l...

Страница 25: ...er you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do not transfer this product unless you give the same notice above to the transferee Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shi...

Страница 26: ... property damage personal injury or death If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Plea...

Страница 27: ...regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures monitor failures and their consequence...

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