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Board Layout, Schematic, and Bill of Materials

Figure 1. Top Assembly Layer

Figure 2. Top Layer

SLVU253 – February 2009

TPS61220EVM-319

3

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Содержание TPS61220EVM-319

Страница 1: ...ed between 1 8 V and 5 5 V by adjusting the value of R1 and R2 See Table 1 for common output voltages and recommended values for R1 and R2 also see data sheet SLVS776 for more information The board fe...

Страница 2: ...s on the conversion ratio between input and output along with Vout consult the data sheet for additional information Configure jumper JP1 as required the EN pin is not pulled up or down inside the dev...

Страница 3: ...www ti com Board Layout Schematic and Bill of Materials Figure 1 Top Assembly Layer Figure 2 Top Layer SLVU253 February 2009 TPS61220EVM 319 3 Submit Documentation Feedback...

Страница 4: ...er Male 2 pin 100 mil spacing 0 100 2 in 2 54 x Open Sullins 50 80 mm 1 JP1 PTC03SAAN Header 3 pin 100 mil spacing 0 100 3 in 2 54 x PTC03SAAN Sullins 76 20 mm 1 L1 4 7 H Inductor Power SMT DCR 145 m...

Страница 5: ...be observed 2 These assemblies must be clean and free from flux and all contaminants Use of no clean flux is not acceptable 3 These assemblies must comply with workmanship standards IPC A 610 Class 2...

Страница 6: ...ncy energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio fr...

Страница 7: ...na type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved...

Страница 8: ...egulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided...

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