Texas Instruments TPS54614EVM 1.8-V SWIFT, Руководство пользователя, Страница: 16 / 33

Thermal Performance
2-4
2.3 Thermal Performance
The plot in Figure 2–4 shows the junction temperature versus the load current
at 25
°
C ambient temperature. The case temperature is plotted in Figure 2–5.
The low junction-to-case thermal resistance of the PWP package, along with
a good board layout, helps to keep the junction temperature low at high output
currents. With a 3.3-V input source and a 6-A load, the junction temperature
is approximately 65
°
C, while the case temperature is approximately 59
°
C.
Figure 2–4. Measured Junction Temperature at 25
°
C Ambient
0
25
50
75
100
125
0 1 2 3 4 5 6 7 8 9
10
IL– Load Current – A
–
Junction T
emperature
–
T
J
C
°
TA = 25
°
C
VI = 3.3 V
VI = 5 V
Figure 2–5. Measured Case Temperature at 25
°
C Ambient
0
20
40
60
80
100
0 1 2 3 4 5 6 7 8 9 10
IL– Load Current – A
Case T
emperature
–
C
°
VI = 5 V
VI = 3.3 V
TA = 25
°
C