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STANDARD TERMS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques

are

used

to

the

extent

TI

deems

necessary.

TI

does

not

test

all

parameters

of

each

EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3

TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

Содержание TPS53313EVM-078

Страница 1: ...Synchronization 16 8 11 Bode Plot 16 8 12 Thermal Image 17 9 EVM Assembly Drawing and PCB Layout 18 10 List of Materials 21 11 Revision History 22 List of Figures Figure 4 1 TPS53313EVM 078 Schematic...

Страница 2: ...VOUT 6 A IOUT FCCM Mode fSW 1 00 MHz 17 Figure 9 1 TPS53313EVM 078 Top Layer Assembly Drawing top view 18 Figure 9 2 TPS53313EVM 078 Bottom Assembly Drawing bottom view 18 Figure 9 3 TPS53313EVM 078 T...

Страница 3: ...e and overtemperature protections Power good indication Pre bias output voltage start up Convenient test points for probing critical waveforms 3 Electrical Performance Specifications Table 3 1 TPS5331...

Страница 4: ...R13 160k R15 R9 10 0k R10 20 0k R11 39 0k TP5 1 2 J1 C6 220pF R16 10 0 C12 22uF C14 22uF TP8 1 2 J5 C16 10nF 1 2 3 4 J3 C5 560pF R2 51 0k C2 22uF TP10 1 EN 2 PG 3 VIN 4 VIN 5 VIN 6 VIN 7 PGND 8 PGND 9...

Страница 5: ...rough TP10 and holding the ground barrel on TP8 as shown in Figure 5 1 Using a leaded ground connection may induce additional noise due to the large ground loop TP10 TP8 Figure 5 1 Tip and Barrel Meas...

Страница 6: ...nnected to J2 as shown in Figure 5 2 Connect a current meter A1 between VIN and J2 to measure the input current Connect a voltmeter V1 at TP3 VIN and TP6 GND to measure the input voltage 5 2 2 Output...

Страница 7: ...ETTING CAPACITANCE OVERCURRENT LIMIT 10 nF 9 A 2 2 nF 4 5 A Open 6 A 6 3 Enable Selection The converter can be enabled and disabled by J1 6 3 1 Default Setting Short to Disable the Converter 6 4 Switc...

Страница 8: ...onnect output signal amplitude measurement probe channel B to TP11 4 Connect ground lead of channel A and channel B to TP13 5 Inject around 10 mV or less signal through the isolation transformer 6 Swe...

Страница 9: ...FCCM Mode Figure 8 1 Efficiency 8 2 Load Regulation 1 18 1 185 1 19 1 195 1 2 1 205 1 21 1 215 1 22 0 1 2 3 4 5 6 ILOAD Load Current A V OUT Output Voltage V VIN 12 V fsw 600 kHz Skip Mode VIN 12 V fs...

Страница 10: ...kip Mode fsw 1 00 MHz IOUT 6 A FCCM Mode fsw 600 kHz IOUT 6 A FCCM Mode fsw 1 00 MHz IOUT 6 A Figure 8 3 Line Regulation Performance Data and Typical Characteristic Curves www ti com 10 TPS53313 Step...

Страница 11: ...Output Load 0 A to 3 A Transient Under Skip Mode 12 V VIN 1 2 V VOUT fSW 600 kHz www ti com Performance Data and Typical Characteristic Curves SLUU819A DECEMBER 2011 REVISED DECEMBER 2021 Submit Docu...

Страница 12: ...utput Ripple at Full Load 12 V VIN 1 2 V VOUT 6 A Skip Mode fSW 600 kHz Performance Data and Typical Characteristic Curves www ti com 12 TPS53313 Step Down Converter Evaluation Module User s Guide SLU...

Страница 13: ...witching Node at Full Load 12 V VIN 1 2 V VOUT 6 A Skip Mode fSW 600 kHz www ti com Performance Data and Typical Characteristic Curves SLUU819A DECEMBER 2011 REVISED DECEMBER 2021 Submit Document Feed...

Страница 14: ...as Start Up Waveform 12 V VIN 1 2 V VOUT 0 A IOUT 1 ms SS Performance Data and Typical Characteristic Curves www ti com 14 TPS53313 Step Down Converter Evaluation Module User s Guide SLUU819A DECEMBER...

Страница 15: ...urrent Protection Waveform 12 V VIN 1 2 V VOUT IOUT increases from 6 A to 7 8 A www ti com Performance Data and Typical Characteristic Curves SLUU819A DECEMBER 2011 REVISED DECEMBER 2021 Submit Docume...

Страница 16: ...0 kHz 8 11 Bode Plot Figure 8 15 Loop Gain 12 V VIN 1 2 V VOUT 6 A IOUT Skip Mode fSW 600 kHz Performance Data and Typical Characteristic Curves www ti com 16 TPS53313 Step Down Converter Evaluation M...

Страница 17: ...Thermal Image 12 V VIN 1 2 V VOUT 6 A IOUT FCCM Mode fSW 1 00 MHz www ti com Performance Data and Typical Characteristic Curves SLUU819A DECEMBER 2011 REVISED DECEMBER 2021 Submit Document Feedback T...

Страница 18: ...Layers 2 oz copper circuit board Figure 9 1 TPS53313EVM 078 Top Layer Assembly Drawing top view Figure 9 2 TPS53313EVM 078 Bottom Assembly Drawing bottom view EVM Assembly Drawing and PCB Layout www t...

Страница 19: ...TPS53313EVM 078 Layer 2 top view www ti com EVM Assembly Drawing and PCB Layout SLUU819A DECEMBER 2011 REVISED DECEMBER 2021 Submit Document Feedback TPS53313 Step Down Converter Evaluation Module Use...

Страница 20: ...3313EVM 078 Bottom Layer top view EVM Assembly Drawing and PCB Layout www ti com 20 TPS53313 Step Down Converter Evaluation Module User s Guide SLUU819A DECEMBER 2011 REVISED DECEMBER 2021 Submit Docu...

Страница 21: ...2 J2 J5 Terminal block 2 pin 6 A 3 5mm 0 27 inch x 0 25 inch ED555 2DS OST 1 J3 Header 2 x 2 pin 100 mil spacing 0 20 inch x 0 20 inch PEC02DAAN Sullins 1 J4 Header male 2 x 6 pin 100 mil spacing 0 1...

Страница 22: ...h 5011 Keystone 4 TP3 TP5 TP9 TP10 Test point red thru hole 0 125 inch x 0 125 inch 5010 Keystone 1 U1 6A Step down Regulator with Integrated Switcher QFN 24 TPS53313RGE TI 4 Shunt 100 mil black 0 100...

Страница 23: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Страница 24: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Страница 25: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Страница 26: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Страница 27: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Страница 28: ...change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of thes...

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