Texas Instruments TPA2035D1, Руководство пользователя

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_
+
IN−
IN+
PWM H−
Bridge
V
O−
V
O+
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
Single-ended
Input
TPA2035D1
Filter-Free Class D
SHUTDOWN
C
I
C
I
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
TPA2035D1
SLOS562 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com
Figure 31. TPA2035D1 Application Schematic With Single-Ended Input
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width.
Figure 32 and Table 1 show the appropriate diameters for a
WCSP layout. The TPA2035D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 32. Land Pattern Dimensions
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