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 Information About Cautions and Warnings

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Preface

 

About This Manual

This user’s guide describes the characteristics, operation, and use of the
TPA3001D1EVM. The user’s guide includes a schematic diagram, bill of mate-
rials (BOM), and board layout diagrams.

How to Use This Manual

This document contains the following chapters:

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Chapter 1—Introduction

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Chapter 2—Quick Start

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Chapter 3—Bill of Materials, Schematic, and PCB Layers

Trademarks

PowerPAD is a trademark of Texas Instruments.

Содержание TPA2012D2EVM

Страница 1: ...December 2002 HPL User s Guide SLOU156...

Страница 2: ...t that any license either express or implied is granted under any TI patent right copyright mask work right or other TI intellectual property right relating to any combination machine or process in wh...

Страница 3: ...handling or use of the goods Please be aware that the products received may not be regulatory compliant or agency certified FCC UL CE etc Due to the open construction of the product it is the user s r...

Страница 4: ...there is uncertainty as to the load specification please contact a TI field representative During normal operation some circuit components may have case temperatures greater than 65 C The EVM is desi...

Страница 5: ...the TPA3001D1EVM The user s guide includes a schematic diagram bill of mate rials BOM and board layout diagrams How to Use This Manual This document contains the following chapters Chapter 1 Introduc...

Страница 6: ...n statement A caution statement describes a situation that could potentially damage your software or equipment This is an example of a warning statement A warning statement describes a situation that...

Страница 7: ...Start 2 1 2 1 Configuration 2 2 2 2 Precautions 2 2 2 3 Quick Start List for the Platform 2 4 2 4 Quick Start List for Stand Alone Operation 2 5 3 Bill of Materials Schematic and PCB Layers 3 1 3 1 TP...

Страница 8: ...atic Diagram 3 3 3 2 TPA3001D1EVM Top Layer 3 4 3 3 TPA3001D1EVM Bottom Layer 3 4 2 1 Typical TI Plug N Play Platform Jumper and Switch Settings for the TPA3001D1 2 2 2 2 Typical TPA3001D1EVM Jumper S...

Страница 9: ...s Instruments TI TPA3001D1EVM class D audio amplifier evaluation module It includes a list of EVM features a brief illustrated description of the module and a list of EVM specifications Topic Page 1 1...

Страница 10: ...2 inches Figure 1 1 and Figure 1 2 Figure 1 1 The TI TPA3001D1 Audio Power Amplifier EVM Top View Figure 1 2 The TI TPA3001D1 Audio Power Amplifier EVM Bottom View Note Single in line header pins ext...

Страница 11: ...rrectly and connects them to a versatile array of standard audio input and output jacks and connectors Easy to use configuration controls allow the platform and EVMs to quickly model many possible end...

Страница 12: ...1 4...

Страница 13: ...d control inputs and signal outputs to the EVM using standard connectors However the audio amplifier evaluation module can be used in stand alone operation by making connections directly to the module...

Страница 14: ...rwise set to OFF 3 R3 must be removed from the TPA3001D1EVM to allow the headphone jack to control the shutdown of the TPA3001D1 Table 2 2 Typical TPA3001D1EVM Jumper Settings EVM GAIN0 GAIN1 TPA3001D...

Страница 15: ...e JP1 JP4 JP5 JP6 JP7 JP8 S1 S2 Note 2 S3 VCC J1 ON ON X Mode X X ON OFF U5 Notes 1 ON Jumper installed OFF Jumper NOT Installed X Don t care 2 Set to ON when tone control board SLOP109 is installed i...

Страница 16: ...B1 U6 POWER SUPPLY U3 U4 U5 U1 U2 Audio Power Amps On Off Conditioning S2 J7 J8 Right Out Left Out JP6 Mode Mute Spk U2 U4 JP8 J9 Left Out JP7 S3 HP Source U2 U4 U5 Polarity Lo Hi HP U5 C3 C2 R3 R4 R5...

Страница 17: ...the TPA3001D1EVM as a stand alone unit or when connecting it into existing circuits or equipment Connections to the TPA3001D1 module header pins can be made via individual sockets wire wrapping or so...

Страница 18: ...current capability to overcome the 120 k pullup resistor on each input Holding down S1 places the amplifier in the shutdown state Releasing S1 returns the amplifier to the active state Refer to the T...

Страница 19: ...and PCB Layers This chapter contains the bill of materials schematic and board layout for the TPS3001D1EVM Topic Page 3 1 TPA3001D1EVM Bill of Materials 3 2 3 2 TPA3001D1EVM Schematic 3 3 3 3 TPA3001...

Страница 20: ...1H221KBN C14 C15 Capacitor ceramic 1000 pF 10 X7R 50 V 805 2 Panasonic ECJ 2VB1H102K L1 L2 Ferrite Bead 0 05 DCR 70 at 100 MHz 3 A 1206 2 Fair Rite 2512067007Y3 R1 R2 R3 R4 Resistor chip 120 k 1 10 W...

Страница 21: ...D VCC VREF BYPASS COSC ROSC AGND AGND BSP PVCC OUTP GAIN1 OUTP PGND PowerPAD 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 R6 51 C9 0 22 F C6 1 F D1 VCC C12 220 pF 1 F C3 1 F C4 1 F V...

Страница 22: ...Layers 3 4 3 3 TPA3001D1EVM PCB Layers The following illustrations depict the TPA3001D1EVM PCB assembly and layers These drawings are not to scale Figure 3 2 TPA3001D1EVM Top Layer Figure 3 3 TPA3001D...

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