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Introduction to the TMP007 and TMP007EVM
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1 Introduction to the TMP007 and TMP007EVM
The TMP007 is an infrared thermopile sensor that measures the temperature of an object without having
to be in contact with it. The integrated thermopile absorbs the infrared energy emitted from the object that
appears in the sensor’s field of view. The thermopile voltage is digitized and input to the integrated math
processor, along with the local die temperature. The processor then computes the corresponding object
temperature.
Default Seebeck coefficients and thermal transient coefficients are encoded into the processor. System
calibration values can be programmed and stored in the built-in, non-volatile memory as user inputs for
improved accuracy. An alert function is also available and can be programmed in the comparator or
interrupt mode.
The EVM consists of two printed circuit boards (PCBs): the SM-USB-DIG and the TMP007 test board. The
SM-USB-DIG communicates with the computer, provides power, and sends and receives appropriate
digital signals. The TMP007 Test Board contains the TMP007 and support circuitry.
1.1 TMP007EVM Kit Contents
Table 1 summarizes the contents of the EVM kit. Figure 1 shows the included hardware. Contact the
Texas Instruments Product Information Center nearest you if any component is missing. Verify you have
the latest versions of the released software by checking the TMP007 product folder on the TI web site at
www.ti.com .
Table 1. TMP007EVM Kit Contents
Item Quantity
TMP007 test board 1
SM-USB-DIG board 1
Figure 1. Hardware Included with TMP007EVM Kit
2 TMP007EVM User's Guide SBOU137A – May 2014 – Revised December 2014
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