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STANDARD TERMS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques

are

used

to

the

extent

TI

deems

necessary.

TI

does

not

test

all

parameters

of

each

EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3

TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

Содержание TLV3811EVM

Страница 1: ...ts 8 4 Layout Guidelines 9 5 Schematic 11 6 Bill of Materials 12 List of Figures Figure 1 1 TLV3811EVM Board Top View 2 Figure 1 2 TLV3811 Block Diagram 2 Figure 1 3 TLV3811EVM Pin Assignments 3 Figur...

Страница 2: ...vide high speed signals to interconnect devices such as FPGAs with minimal power dissipation Figure 1 1 TLV3811EVM Board Top View 1 1 Features Low Propagation Delay Low Overdrive Dispersion High Toggl...

Страница 3: ...kes it easy to measure propagation delay since the reference voltage is known to be 0V Single supply option still available High Speed Functional Generator with fast rise fall time recommended 500 ps...

Страница 4: ...a 50 mV overdrive and 50 mV underdrive Disable the signal generator output Connect the signal generator output to IN 5 Connect the inverting input IN to ground to establish the threshold for the compa...

Страница 5: ...OUT reaches 0 V The propagation delay was measured at approximately 206 ps with the setup described Channel 4 OUT Channel 1 100mV peak to peak VOD 50mV VUD 50mV 10MHz Channel 3 OUT Figure 2 2 Quick St...

Страница 6: ...tion The recommended voltage range is from 2 7 V to 5 5 V Connect VCC VEE and SYS_GND using TP1 TP2 and TP3 respectively Figure 3 1 TLV3811EVM Supply Voltage Connection Board Setup www ti com 6 TLV381...

Страница 7: ...y the input signal generator otherwise they can be left uninstalled R1 0 R4 0 GND IN _SENSE IN _SENSE VCC VEE IN IN GND Figure 3 2 Input Side Schematic Without Optional Resistors R2 and R3 Additionall...

Страница 8: ...charging and discharging of the capacitors A higher duty cycle will result in a higher DC output voltage because the capacitors are charging more than they are discharging GND VCC VEE C7 0 1uF C8 0 1u...

Страница 9: ...lines Top Layer GND 1 Layer GND 2 Layer Bottom Layer Figure 4 1 Layers www ti com Layout Guidelines SNOU189 MAY 2022 Submit Document Feedback TLV3811EVM User s Guide 9 Copyright 2022 Texas Instruments...

Страница 10: ..._GND IN IN IN _SENSE IN _SENSE VCC VEE SYS_GND Figure 4 2 TLV3811 EVM Block Diagram Layout Guidelines www ti com 10 TLV3811EVM User s Guide SNOU189 MAY 2022 Submit Document Feedback Copyright 2022 Tex...

Страница 11: ...5 Schematic Figure 5 1 TLV3811 EVM Schematic www ti com Schematic SNOU189 MAY 2022 Submit Document Feedback TLV3811EVM User s Guide 11 Copyright 2022 Texas Instruments Incorporated...

Страница 12: ...5 J6 6 SMA Connector Receptacle Female Socket 50Ohm Board Edge End Launch Solder 0732511150 Molex Inc J7 J8 2 Header 100mil 2x1 Gold TH Header 2 54mm 2x1 TH HMTSW 102 07 G S 240 Samtec LBL1 1 Thermal...

Страница 13: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Страница 14: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Страница 15: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Страница 16: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Страница 17: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Страница 18: ...change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of thes...

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