Texas Instruments TAS5722L, Руководство пользователя, Страница: 5 / 18

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General Description
5 SLAU692 – September 2016
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Copyright © 2016, Texas Instruments Incorporated
TAS5722L Evaluation Board
3 General Description
The TAS5722L device is a high-efficiency mono Class-D audio power amplifier optimized for high transient
power capability to use the dynamic power headroom of small loudspeakers. It is capable of delivering
more than 14-W continuously into a 4-
Ω
speaker. The device has two address pins, which allow up to 8
I
2
C addressable devices to share a common TDM bus.
The TAS5722L device SAIF supports a variety of standard stereo serial audio formats including I
2
S, Left
justified and Right justified. It also supports a time division multiplexed (TDM) format that is capable of
transporting up to 8 channels of audio data on a single bus.
4 Operating Conditions
Table 2 lists the EVM operating conditions.
Table 2. EVM Operating Conditions
Parameter Operating Condition
PVDD and AVDD 4.5 V to 17 V
DVDD 1.65 V to 2 V
Minimum speaker load 3.2 Ω
I
2
C Clock Frequency Up to 400 kHz
5 PCB Layout Guidelines
Use the following guidlines for PCB layout:
• Pay special attention to the power stage power supply layout. Each H-bridge has two PVDD input pins
so that decoupling capacitors can be placed nearby. Use at least a 0.1-
μ
F capacitor of X5R quality or
better for each set of inputs.
• Keep the current circulating loops containing the supply decoupling capacitors, the H-bridges in the
device, and the connections to the speakers as tight as possible, to reduce emissions.
• Use ground planes to provide the lowest impedance for power and signal current between the device
and the decoupling capacitors. The area directly under the device should be treated as a central
ground area for the device, and all device grounds must be connected directly to that area.
• Use a via pattern to connect the area directly under the device to the ground planes in copper layers
below the surface. This connection helps to dissipate heat from the device.
• Avoid interrupting the ground plane with circular traces around the device. Interruption disconnects the
copper and interrupt flow of heat and current. It is better to use radial copper traces, if necessary.