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CC3135MOD

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SWRS225B – FEBRUARY 2019 – REVISED MARCH 2020

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CC3135MOD

Applications, Implementation, and Layout

Table 7-1

lists the bill of materials for a typical application using the CC3135MOD module shown in

Figure 7-3

Table 7-1. Bill of Materials

QTY

PART
REFERENCE

VALUE

MANUFACTURER

PART NUMBER

DESCRIPTION

C1, C2

0.1 uF

Murata

GRM155R61A104KA01D

Capacitor, ceramic, 0.1 uF, 10 V,
±10%, X5R, 0402

3.3 pF

Murata

GJM1555C1H3R3BB01

Capacitor, ceramic, 3.3 pF, 50 V,
±0.1pF, C0G/NP0, 0402

C4, C5

100 uF

Murata

LMK325ABJ107MMHT

Capacitor, ceramic, 100 uF, 10 V,
±20%, X5R, AEC-Q200 Grade 3,
1210

2.4 GHz, 5 GHz
Ant

Ethertronics

M830520

Antenna Bluetooth WLAN Zigbee®

3 nH

Murata

LQG15HS3N0S02D

Inductor, Unshielded, Multilayer, 3nH,
0.8 A, 0.125

, SMD

10k

Vishay-Dale

CRCW040210K0JNED

RES, 10 k, 5%, 0.063 W, AEC-Q200
Grade 0, 0402

CC1

CC3135MOD

Texas Instruments

CC3135MODRNMMOBR

SimpleLink™ Certified Wi-Fi® Dual-
Band Network Processor Internet-of-
Things Module Solution for MCU
Applications, MOB0063A

Содержание SimpleLink CC3135MOD

Страница 1: ... and SSL 3 0 Built in power management subsystem Configurable low power profiles always on intermittently connected tag Advanced low power modes Integrated DC DC regulators Application throughput UDP 16 Mbps TCP 13 Mbps Multilayered Security Features Separate execution environments Networking security Device identity and key Hardware accelerator cryptographic engines AES DES SHA MD5 CRC File syste...

Страница 2: ...h built in security protocols the CC3135MOD solution provides a robust and simple security experience The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash RF filters diplexer crystal and passive components that are fully integrated This generation introduces new capabilities that further simplify the connectivity of things to the ...

Страница 3: ...WRF_A HiB 3 CC3135MOD www ti com SWRS225B FEBRUARY 2019 REVISED MARCH 2020 Submit Documentation Feedback Product Folder Links CC3135MOD Module Overview Copyright 2019 2020 Texas Instruments Incorporated 1 4 Functional Block Diagrams Figure 1 1 shows the functional block diagram of the CC3135MOD module Figure 1 1 CC3135MOD Module Functional Block Diagram ...

Страница 4: ... External MCU Crypto Engines POWER MANAGEMENT Oscillators DC DC RTC Wi Fi Network Processor Hardware 1x SPI 1x UART Host Interface Dual Band Wi Fi 4 CC3135MOD SWRS225B FEBRUARY 2019 REVISED MARCH 2020 www ti com Submit Documentation Feedback Product Folder Links CC3135MOD Module Overview Copyright 2019 2020 Texas Instruments Incorporated Figure 1 2 shows the CC3135 hardware overview Figure 1 2 CC3...

Страница 5: ...equirements 26 5 13 Reset Requirement 26 5 14 Thermal Resistance Characteristics for MOB Package 26 5 15 Timing and Switching Characteristics 27 5 16 External Interfaces 29 6 Detailed Description 33 6 1 Overview 33 6 2 Module Features 33 6 3 Power Management Subsystem 37 6 4 Low Power Operating Modes 38 6 5 Restoring Factory Default Configuration 38 6 6 Hostless Mode 39 6 7 Device Certification an...

Страница 6: ...older Links CC3135MOD Revision History Copyright 2019 2020 Texas Instruments Incorporated 2 Revision History Changes from Revision A August 2019 to Revision B Page Added WPA3 Personal in Section 1 1 Features 1 Corrected the pin numbers for HOST_SPI_MISO and HOST_SPI_nCS in Table 4 2 Signal Descriptions 14 ...

Страница 7: ...6 IPv4 IPv6 Secured sockets 16 16 16 Integrated MCU Arm Cortex M4 at 80 MHz Arm Cortex M4 at 80 MHz On Chip Memory RAM 256KB 256KB Flash 1MB Peripherals and Interfaces Universal Asynchronous Receiver and Transmitter UART 1 2 2 Serial Port Interface SPI 1 1 1 Multi Channel Audio Serial Port McASP I2S or PCM 2 ch 2 ch Inter Integrated Circuit I2 C 1 1 Analog to Digital Converter ADC 4 ch 12 bit 4 ch...

Страница 8: ...ny MCU to allow developers to design new Wi Fi products or upgrade existing products with Wi Fi capabilities For more information visit www ti com simplelinkwifi MSP432 Host MCU The MSP432P401R MCU features the Arm Cortex M4 processor offering ample processing capability with floating point unit and memory footprint for advanced processing algorithm communication protocols as well as application n...

Страница 9: ...58 62 55 26 23 22 21 27 25 24 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 45 48 49 50 44 46 47 51 52 53 54 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 9 CC3135MOD www ti com SWRS225B FEBRUARY 2019 REVISED MARCH 2020 Submit Documentation Feedback Product Folder Links CC3135MOD Terminal Configuration and Functions Copyright 2019 2020 Texas Instruments Incorporated 4 Terminal Configuration...

Страница 10: ...ice drives a positive voltage to signal pads when the CC3135MOD is not powered DC current is drawn from the other device If the drive strength of the external device is adequate an unintentional wakeup and boot of the CC3135MOD device can occur To prevent current draw TI recommends one of the following All devices interfaced to the CC3135MOD must be powered from the same power rail as the CC3135MO...

Страница 11: ... SPI data output 8 HOST_SPI_nCS Hi Z I 8 Host interface SPI chip select active low 9 DIO12 Y Y Y O 3 Digital input or output 10 DIO13 Y Y Y 4 Digital input or output 11 HOST_INTR Hi Z O 15 Interrupt output active high 12 DIO23 Y Y Y Hi Z 16 Digital input or output 13 FLASH _SPI_MISO N A N A N A Hi Z I External Serial Flash Programming SPI data in 14 FLASH _SPI_CS N A N A N A Hi Z O External Serial...

Страница 12: ... Z I 32 There is an internal 100 kΩ pull up resistor option from the nRESET pin to VBAT_RESET Note VBAT_RESET is not connected to VBAT1 or VBAT2 within the module The following connection schemes are recommended Connect nRESET to a GPIO from the host only if nRESET will be in a defined state under all operating conditions Leave VBAT_RESET unconnected to save power If nRESET cannot be in a defined ...

Страница 13: ... A N A No Connect 46 UART1_TX Hi Z O 55 UART interface to host transmit 47 UART1_RX Hi Z I 57 UART interface to host receive 48 TEST_58 Y Y Y Hi Z O 58 Test signal connect to an external test point 49 TEST_59 Y Y Y Hi Z O 59 Test signal connect to an external test point 50 TEST_60 Y Y Y Hi Z O 60 Test signal connect to an external test point 51 UART1_nCTS Hi Z I 61 UART interface to host clear to ...

Страница 14: ... DIO8 53 I O O DIO9 54 I O O BLE 2 4 GHz Radio coexistence 2 DIO10 3 I O I O Coexistence inputs and outputs DIO12 9 I O I O DIO13 10 I O I O DIO23 12 I O I O DIO24 18 I O I O DIO28 19 1 I O I O DIO29 22 I O I O DIO30 42 1 I O I O DIO3 48 I O I O DIO4 49 I O I O DIO5 50 I O I O DIO8 53 I O I O DIO9 54 I O I O Hostless Mode DIO10 3 I O I O Hostless mode inputs and outputs DIO12 9 I O I O DIO13 10 I ...

Страница 15: ...RT1 clear to send active low Sense On Power SOP2 23 3 O I Sense on power 2 SOP1 24 I I Configuration sense on power 1 SOP0 34 I I Configuration sense on power 0 Power VBAT1 37 Power supply for the module VBAT2 40 Power supply for the module nHIB nHIB 4 I I Hibernate signal input to the NWP subsystem active low RF RF_ABG 31 I O I O WLAN analog RF 802 11 a b g n bands Test Port TEST_58 48 O O Test S...

Страница 16: ... Leave unused GPIOs as NC No Connect NC 20 21 33 39 41 45 Unused pin leave as NC SOP Configuration sense on power 23 24 34 Leave as NC Modules contain internal 100 kΩ pull down resistors on the SOP lines An external 10 kΩ pull up resistor is required for factory restore See Section 6 5 Reset RESET input for the device 35 36 There is an internal 100 kΩ pull up resistor option from the nRESET pin to...

Страница 17: ...al I O 0 5 VBAT 0 5 V RF pin 0 5 2 1 V Analog pins 0 5 2 1 V Operating temperature TA 40 85 C Storage temperature Tstg 40 85 C Junction temperature Tj 3 120 C 1 JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process 2 JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process 5 2 ESD Ratings VALUE UNI...

Страница 18: ...er level 0 248 TX power level 4 179 54 OFDM TX power level 0 223 TX power level 4 160 RX 3 1 DSSS 53 mA 54 OFDM 53 Idle connected 4 690 µA LPDS 115 µA Hibernate 5 5 µA Shutdown 1 µA Peak calibration current 5 3 VBAT 3 6 V 420 mA VBAT 3 3 V 450 VBAT 2 3 V 610 1 TX power level 0 implies maximum power see Figure 5 1 Figure 5 2 and Figure 5 3 TX power level 4 implies output power backed off approximat...

Страница 19: ... For the 2 4 GHz band it is possible to lower the overall output power at a global level using the global TX power level setting In addition the 2 4 GHz band allows the user to enter additional back offs 1 per channel region 2 and modulation rates 3 4 via Image creator see the UniFlash CC31xx CC32xx SimpleLink Wi Fi and Internet on a chip Solution ImageCreator and Programming Tool User s Guide for...

Страница 20: ...ti com Submit Documentation Feedback Product Folder Links CC3135MOD Specifications Copyright 2019 2020 Texas Instruments Incorporated Figure 5 2 TX Power and IBAT vs TX Power Level Settings 6 OFDM Figure 5 3 TX Power and IBAT vs TX Power Level Settings 54 OFDM ...

Страница 21: ...75 dBm in 0 125 dBm increments 6 The antenna gain has a range of 2 dBi to 5 75 dBi in 0 125 dBi increments 5 7 TX Power Control for 5 GHz Band 5 GHz power control is done via Image Creator where the maximum transmit power is provided 1 Within Image Creator power control is possible per channel region 2 and modulation rates 3 In addition it is possible to enter an additional back off 4 factor per c...

Страница 22: ...use a drop in the supply voltage potentially triggering a brownout condition The resistance includes the internal resistance of the battery contact resistance of the battery holder four contacts for a 2 AA battery and the wiring and PCB routing resistance NOTE When the device is in the Hibernate state brownout is not detected only blackout is in effect during the Hibernate state Figure 5 4 Brownou...

Страница 23: ... TEST CONDITIONS 1 MIN NOM MAX UNIT CIN Pin capacitance 4 pF VIH High level input voltage 0 65 VDD VDD 0 5 V V VIL Low level input voltage 0 5 0 35 VDD V IIH High level input current 5 nA IIL Low level input current 5 nA VOH High level output voltage IL 2 mA configured I O drive strength 2 mA 2 4 V VDD 3 6 V VDD 0 8 V IL 4 mA configured I O drive strength 4 mA 2 4 V VDD 3 6 V VDD 0 7 V IL 8 mA con...

Страница 24: ...red at the SoC pin on channel 6 2437 MHz PARAMETER TEST CONDITIONS Mbps MIN TYP MAX UNIT Sensitivity 8 PER for 11b rates 10 PER for 11g 11n rates 1 1 DSSS 94 5 dBm 2 DSSS 92 5 11 CCK 86 5 6 OFDM 89 9 OFDM 88 5 18 OFDM 85 36 OFDM 79 54 OFDM 73 MCS7 GF 2 70 Maximum input level 10 PER 802 11b 2 5 dBm 802 11g 8 5 1 Sensitivity for mixed mode is 1 dB worse Table 5 3 WLAN Receiver Characteristics 5 GHz ...

Страница 25: ...B from IEEE spectral mask or EVM 1 DSSS 16 dBm 2 DSSS 16 11 CCK 16 3 6 OFDM 15 3 9 OFDM 15 3 18 OFDM 15 36 OFDM 14 54 OFDM 12 5 MCS7 11 Transmit center frequency accuracy 25 25 ppm 1 Transmit power will be reduced by 1 5dB for VBAT 2 8V 2 FCC channels 36 60 64 100 and 140 where harmonics sub harmonics of fall in the FCC restricted band have reduced output power to meet the FCC RSE requirement 3 Th...

Страница 26: ... and Tf Rise and fall times 20 µs 1 C W degrees Celsius per watt 2 These values are based on a JEDEC defined 2S2P system with the exception of the Theta JC RΘJC value which is based on a JEDEC defined 1S0P system and will change based on environment as well as application For more information see these EIA JEDEC standards JESD51 2 Integrated Circuits Thermal Test Method Environmental Conditions Na...

Страница 27: ...up and reset removal Table 5 7 First Time Power Up and Reset Removal Timing Requirements ITEM NAME DESCRIPTION MIN TYP MAX UNIT T1 nReset time nReset timing after VBAT supplies are stable 1 ms T2 Hardware wake up time 25 ms T3 Initialization time Internal 32 kHz XTAL settling plus firmware initialization time plus radio calibration 1 35 s 5 15 2 Power Down Sequencing For proper power down of the C...

Страница 28: ...is kept above the minimum requirement under all conditions such as power up MCU reset and so on 5 15 4 Wakeup From HIBERNATE Mode Timing Figure 5 7 shows the timing diagram for wakeup from HIBERNATE mode Figure 5 7 nHIB Timing Diagram NOTE The internal 32 768 kHz XTAL is kept enabled by default when the chip goes into HIBERNATE mode in response to nHIB being pulled low Table 5 8 describes the timi...

Страница 29: ...135MOD module can interrupt the host using the HOST_INTR line to initiate the data transfer over the interface The SPI host interface can work up to a speed of 20 MHz Figure 5 8 shows the SPI host interface Figure 5 8 SPI Host Interface Table 5 9 lists the SPI host interface pins Table 5 9 SPI Host Interface PIN NAME DESCRIPTION HOST_SPI_CLK Clock up to 20 MHz from MCU host to CC3135MOD module HOS...

Страница 30: ...time 4 ns T7 tIH RX data hold time 4 ns T8 tOD TX data output delay 20 ns T9 tOH TX data hold time 24 ns 1 The SimpleLink device does not support automatic detection of the host length while using the UART interface 5 16 2 Host UART Interface The SimpleLink device requires the UART configuration described in Table 5 11 Table 5 11 SimpleLink UART Configuration PROPERTY SUPPORTED CC3135 CONFIGURATIO...

Страница 31: ...e from the device to the host controller to allow efficient low power mode Figure 5 10 shows the typical and recommended UART topology because it offers the maximum communication reliability and flexibility between the host and the SimpleLink device Figure 5 10 Typical 5 Wire UART Topology 5 16 2 2 4 Wire UART Topology The 4 wire UART topology eliminates the host IRQ line see Figure 5 11 Using thi...

Страница 32: ...mpleLink device because there is no flow control in this direction Because there is no full flow control the host cannot stop the SimpleLink device to send its data thus the following parameters must be carefully considered Maximum baud rate RX character interrupt latency and low level driver jitter buffer Time consumed by the user s application 5 16 3 External Flash Interface The CC3135MOD module...

Страница 33: ...P client modes Autocalibrated radio with a single ended 50 Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design Advanced connection manager with multiple user configurable profiles stored in a serial Flash allows automatic fast connection to an access point without user or host intervention Supports all common Wi Fi security modes for personal and ...

Страница 34: ...onfiguring application content Dynamic user callbacks Service discovery Multicast DNS service discovery allows a client to advertise its service without a centralized server After connecting to the access point the CC3135 device provides critical information such as device name IP vendor and port number DHCP server Ping Table 6 1 summarizes the NWP features Table 6 1 NWP Features Feature Descripti...

Страница 35: ...ansceiver Programmable RX filters with event trigger mechanism Rx Metrics for tracking the surrounding RF environment 6 2 2 1 Security The SimpleLink Wi Fi CC3135MOD internet on a chip module enhances the security capabilities available for development of IoT devices while completely offloading these activities from the MCU to the networking subsystem The security capabilities include the followin...

Страница 36: ...EC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256 SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384 SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256 SL...

Страница 37: ... at a clock speed of 20 MHz Interfaces over UART with any MCU with a baud rate up to 3 Mbps A low footprint driver is provided for TI MCUs and is easily ported to any processor or ASIC Simple APIs enable easy integration with any single threaded or multithreaded application 6 2 5 System Connects directly to a battery Ultra low leakage when disabled hibernate mode with a current of less than 5 5 µA...

Страница 38: ...k RTC is kept running and the module wakes up when the n_HIB line is asserted by the host driver The typical battery drain in this mode is 5 5 µA The wake up time is longer than LPDS mode at about 50 ms 6 4 3 Shutdown Shutdown mode is the lowest power mode system wise All device logics are off including the realtime clock RTC The typical battery drain in this mode is 1 µA The wake up time in this ...

Страница 39: ... using a combinatorial AND condition between them The actions are divided into two types those that can occur during runtime and those that can occur only during the initialization phase The following actions can only be performed when triggered by the pre initialization condition Set roles AP station P2P and Tag modes Delete all stored profiles Set connection policy Hardware GPIO indication allow...

Страница 40: ...01893 v2 1 1 5GHz Wi Fi EN62311 2008 MPE EN301489 1 v2 2 1 EMC General EN301489 17 v3 2 0 EMC Wi Fi EN60950 1 2006 A11 2009 A1 2010 A12 2011 A2 2013 MIC Japan Article 49 20 of ORRE 201 190034 6 7 1 FCC Certification and Statement CAUTION FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment This equipment should be ...

Страница 41: ...to the following two conditions This device may not cause interference This device must accept any interference including interference that may cause undesired operation of the device Le présent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autorisée aux deus conditions suivantes L appareil ne doit pas produire de brouillage ...

Страница 42: ...s the SimpleLink CC3135 module markings Table 6 3 lists the SimpleLink CC3135 module markings Figure 6 1 SimpleLink CC3135 Module Markings Table 6 3 Marking Descriptions MARKING DESCRIPTION CC3135MODRNMMOB Model YMWLLLC LTC Lot Trace Code Y Year M Month WLLLC Reserved for internal use Z64 CC3135MOD FCC ID single modular FCC grant ID 451I CC3135MOD IC single modular IC grant ID MIC compliance mark ...

Страница 43: ... system using this module must display a visible label indicating the following text Contains IC 451I CC3135MOD This module is designed to comply with the JP statement 201 190034 The host system using this module must display a visible label indicating the following text Contains transmitter module with certificate number 201 190034 6 10 Manual Information to the End User The OEM integrator must b...

Страница 44: ...rt BLE 2 4 GHz radio coexistence Because WLAN is inherently more tolerant to time domain disturbances the coexistence mechanism gives priority to the Bluetooth low energy entity over the WLAN Bluetooth low energy operates in the 2 4 GHz band therefore the coexistence mechanism does not affect the 5 GHz band The CC3135MOD device can operate normally on the 5 GHz band while the Bluetooth low energy ...

Страница 45: ...he WLAN operating on either a 2 4 or a 5 GHz band Note in this implementation no Coex switch is required and only a single GPIO from the BLE device to the CC3135 device is required Figure 7 1 Dual Antenna Coexistence Mode Block Diagram 7 1 2 Antenna Selection The CC3135MOD device is designed to also support antenna selection and is controlled from Image Creator When enabled there are 3 options pos...

Страница 46: ...019 2020 Texas Instruments Incorporated 3 The recommended Antenna switch is the Richwave RTC6608OSP Figure 7 2 shows the antenna selection implementation for Wi Fi with BLE operating on it s own antenna Note in this implementation only a single GPIO from the BLE device to the CC3135MOD device is required The Antenna switch 3 is controlled by 2 GPIO lines from the CC3135MOD device Table 4 2 lists w...

Страница 47: ... GND 58 GND 59 GND 60 GND 61 GND 62 GND 63 HOST_INTR 11 HOST_SPI_CLK 5 HOST_SPI_DIN 6 HOST_SPI_DOUT 7 HOST_SPI_CS 8 FLASH_SPI_MISO 13 FLASH_SPI_CS_IN 14 NC 33 FLASH_SPI_CLK 15 NC 41 DIO30 42 DIO10 3 NC 45 DIO8 53 DIO9 54 FLASH_SPI_M OSI 17 DIO24 18 NC 20 DIO29 22 GND 25 GND 26 DIO12 9 DIO23 12 GND 29 RESERVED 21 DIO28 19 RF_ABG 31 SOP0 34 SOP1 24 SOP2 23 TEST_58 48 TEST_59 49 TEST_60 50 TEST_62 52...

Страница 48: ...REVISED MARCH 2020 www ti com NOTE The following guidelines are recommended for implementation of the RF design Ensure an RF path is designed with an impedance of 50 Ω Tuning of the antenna impedance π matching network is recommended after manufacturing of the PCB to account for PCB parasitics π or L matching and tuning may be required between cascaded passive components on the RF path ...

Страница 49: ...R61A104KA01D Capacitor ceramic 0 1 uF 10 V 10 X5R 0402 1 C3 3 3 pF Murata GJM1555C1H3R3BB01 Capacitor ceramic 3 3 pF 50 V 0 1pF C0G NP0 0402 2 C4 C5 100 uF Murata LMK325ABJ107MMHT Capacitor ceramic 100 uF 10 V 20 X5R AEC Q200 Grade 3 1210 1 E1 2 4 GHz 5 GHz Ant Ethertronics M830520 Antenna Bluetooth WLAN Zigbee 1 L1 3 nH Murata LQG15HS3N0S02D Inductor Unshielded Multilayer 3nH 0 8 A 0 125 Ω SMD 1 ...

Страница 50: ...is section details the PCB guidelines to speed up the PCB design using the CC3135MOD Module The integrator of the CC3135MOD module must comply with the PCB layout recommendations described in the following subsections to preserve minimize the risk with regulatory certifications for FCC IC ISED ETSI CE and MIC Moreover TI recommends customers follow the guidelines described in this section to achie...

Страница 51: ...7 2 2 RF Layout Recommendations The RF section of this wireless device gets top priority in terms of layout It is very important for the RF section to be laid out correctly to ensure optimum performance from the device A poor layout can cause low output power EVM degradation sensitivity degradation and mask violations Figure 7 4 shows the RF placement and routing of the CC3135MOD module Figure 7 4...

Страница 52: ...ck Product Folder Links CC3135MOD Applications Implementation and Layout Copyright 2019 2020 Texas Instruments Incorporated For optimal RF performance ensure the copper cut out on the top layer under the RF BG pin pin 31 is as shown in Figure 7 5 Figure 7 5 Top Layer Copper Pull Back on RF Pads ...

Страница 53: ...is cleared on inner layers as well 4 Ensure that there is provision to place matching components for the antenna These must be tuned for best return loss when the complete board is assembled Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance 5 Ensure that the antenna impedance is 50 Ω because the device is rated to work only with a 50 Ω syste...

Страница 54: ...Coplanar Waveguide with ground CPW G structure CPW G structure offers the maximum amount of isolation and the best possible shielding to the RF lines In addition to the ground on the L1 layer placing GND vias along the line also provides additional shielding Figure 7 6 shows a cross section of the coplanar waveguide with the critical dimensions Figure 7 7 shows the top view of the coplanar wavegui...

Страница 55: ...rated The recommended values for the PCB are provided for 2 layer boards in Table 7 4 and 4 layer boards in Table 7 5 Table 7 4 Recommended PCB Values for 2 Layer Board L1 to L2 42 1 mils PARAMETER VALUE UNIT W 26 mils S 5 5 mils H 42 1 mils Er FR 4 substrate 4 2 F m Table 7 5 Recommended PCB Values for 4 Layer Board L1 to L2 16 mils PARAMETER VALUE UNITS W 21 mils S 10 mils H 16 mils Er FR 4 subs...

Страница 56: ...must be blue 30 8 4 PCB Assembly Guide The wireless MCU modules are packaged in a substrate base Leadless Quad Flatpack QFM package Components were mounted onto the substrate with standard SMT process with the additional of a metal lid covering the top of the module The module are designed with pull back leads for easy PCB layout and board mounting 8 4 1 PCB Land Pattern Thermal Vias We recommende...

Страница 57: ...silhouette A vision system that locates individual pads on the interconnect pattern The second type renders more accurate placements but tends to be more expensive and time consuming Both methods are acceptable since the parts align due to a self centering features fo the solder joint during solder reflow It is recommended to release the package to 1 to 2 mils into the solder paste or with minimum...

Страница 58: ... Reflow soldering will be done according to the temperature profile see Figure 8 1 Peak temp 260 C Figure 8 1 Temperature Profile for Evaluation of Solder Heat Resistance of a Component at Solder Joint Table 8 1 Temperature Profile Profile Elements Convection or IR 1 Peak temperature range 235 to 240 C typical 260 C maximum Pre heat soaking 150 to 200 C 60 to 120 seconds Time above melting point 6...

Страница 59: ... Wi Fi CC3135 SDK plugin and TI SimpleLink Wi Fi CC3235 Software Development Kit SDK The new provisioning release is a TI recommendation for Wi Fi provisioning using SimpleLink Wi Fi products The provisioning release implements advanced AP mode and SmartConfig technology provisioning with feedback and fallback options to ensure successful process has been accomplished Customers can use both embedd...

Страница 60: ...t documentation which describes the processor related peripherals and other technical collateral follows The following documents provide support for the CC3135MOD module Application Reports Transfer of TI s Wi Fi Alliance Certifications to Products Based on SimpleLink This document explains how to employ the Wi Fi Alliance WFA derivative certification transfer policy to transfer a WFA certificatio...

Страница 61: ... work seamlessly on Texas Instruments evaluation platforms such as the BoosterPack plus FTDI emulation board for CC3235 devices and the LaunchPad for CC3235 devices 9 5 Trademarks SimpleLink LaunchPad Code Composer Studio BoosterPack Internet on a chip are trademarks of Texas Instruments Arm Cortex are registered trademarks of Arm Limited Bluetooth is a registered trademark of Bluetooth SIG Inc IO...

Страница 62: ...e information This information is the most current data available for the designated devices This data is subject to change without notice and revision of this document 10 1 Mechanical Land and Solder Paste Drawings NOTE The total height of the module is 2 4 mm The weight of the module is 1 8g typical NOTE 1 All dimensions are in mm 2 Solder mask should be the same or 5 larger than the dimension o...

Страница 63: ...compatible and free of Bromine Br and Antimony Sb based flame retardants Br or Sb do not exceed 0 1 by weight in homogeneous material space 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature space 4 There may be additional marking which relates to the logo the lot trace code information or the environmental cat...

Страница 64: ...D SWRS225B FEBRUARY 2019 REVISED MARCH 2020 www ti com Submit Documentation Feedback Product Folder Links CC3135MOD Mechanical Packaging and Orderable Information Copyright 2019 2020 Texas Instruments Incorporated 10 2 2 Tape and Reel Information ...

Страница 65: ...RS225B FEBRUARY 2019 REVISED MARCH 2020 Submit Documentation Feedback Product Folder Links CC3135MOD Mechanical Packaging and Orderable Information Copyright 2019 2020 Texas Instruments Incorporated 10 2 2 1 Tape Specifications ...

Страница 66: ...16 28 43 QFM 2 4 mm max height MOB0063A QUAD FLAT MODULE 4221462 D 06 2019 NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change without notice AREA PIN 1 INDEX 0 1 X1 45 PIN 1 ID 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 0 15 C A B 0 05 C 56 59 62 SCALE 0 650 ...

Страница 67: ... 2019 NOTES continued 3 This package is designed to be soldered to a thermal pad on the board For more information see Texas Instruments literature number SLUA271 www ti com lit slua271 LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE 6X PKG PKG SEE DETAIL 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 METAL UNDER SOLDER MASK SOLDER MASK OPENING 9X 45 X 1 56 59 62 SOLDER MASK OPENING METAL UNDE...

Страница 68: ...ued 4 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC 7525 may have alternate design recommendations PKG PKG 1 2 15 16 17 27 28 29 42 43 44 54 55 57 58 60 63 61 SOLDER PASTE EXAMPLE BASED ON 0 125 mm THICK STENCIL EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA PAD 55 77 5 PADS 56 63 79 SCALE 6X SEE DETAILS 56 59 62 SOLDER MASK EDGE SOLDER MASK ED...

Страница 69: ...se resources are subject to change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for...

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