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IMPORTANT NOTICE FOR TI REFERENCE DESIGNS

Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers (“Buyers”) who are developing systems that
incorporate TI semiconductor products (also referred to herein as “components”). Buyer understands and agrees that Buyer remains
responsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products.

TI reference designs have been created using standard laboratory conditions and engineering practices.

TI has not conducted any

testing other than that specifically described in the published documentation for a particular reference design.

TI may make

corrections, enhancements, improvements and other changes to its reference designs.

Buyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the
reference design in the development of their end products. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL
OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY
OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right,
or other intellectual property right relating to any combination, machine, or process in which TI components or services are used.
Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.

TI REFERENCE DESIGNS ARE PROVIDED "AS IS". TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE
REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY OR
COMPLETENESS. TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY
INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE THEREOF. TI SHALL NOT BE LIABLE
FOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INFRINGEMENT CLAIM THAT RELATES TO
OR IS BASED ON A COMBINATION OF COMPONENTS PROVIDED IN A TI REFERENCE DESIGN. IN NO EVENT SHALL TI BE
LIABLE FOR ANY ACTUAL, SPECIAL, INCIDENTAL, CONSEQUENTIAL OR INDIRECT DAMAGES, HOWEVER CAUSED, ON ANY
THEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, ARISING IN
ANY WAY OUT OF TI REFERENCE DESIGNS OR BUYER’S USE OF TI REFERENCE DESIGNS.

TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per
JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant
information before placing orders and should verify that such information is current and complete. All semiconductor products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI
deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not
necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.

Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for
such altered documentation. Information of third parties may be subject to additional restrictions.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that
anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate
remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in
Buyer’s safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed an agreement specifically governing such use.

Only those TI components that TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that
have

not

been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory

requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2014, Texas Instruments Incorporated

Содержание SERDESUB-16OVT

Страница 1: ... 2012 SERDESUB 16OVT EVM User s Guide 1 TABLE OF CONTENTS TABLE OF CONTENTS 1 1 DESCRIPTION 2 2 KIT CONTENTS 3 3 SYSTEM REQUIREMENTS 3 4 SETUP INSTRUCTIONS 4 5 BLOCK DIAGRAMS 5 6 OPERATION 6 7 BOM BILL OF MATERIALS 8 8 APPENDIX 10 Serializer and Deserializer PCB Schematics 10 ...

Страница 2: ...ntrol channel of the DS90UB901Q 902Q provides seamless communication between the camera and Host Controller The Serializer board provides LVCMOS inputs and a bidirectional control channel I2C compatible from the Image Sensor and is converted to a FPD Link III LVDS data pair on the DS90UB901Q Tx board The DS90UB902Q Rx board receives the FPD Link III LVDS serialized data stream and converts it back...

Страница 3: ...ed in order to use the SERDESUB 16OVT EVM kit o OmniVision camera sensor module OV10620 OV7710 OV9715 o Host Controller with I2C interface bus I2C master FPGA Electronic Control Unit ECU Video Processor Microcontroller Slave clock stretching must be supported by the I2C master controller o CAT6 cable o External 5VDC 1A Power Supply Figure 1 Imager Sensor Serializer and Deserializer Board Connectio...

Страница 4: ... to the Deserializer board J10 power jack 5 Push ON button S4 on Deserializer board Green light should now be visible on RJ45 connectors at Serializer J4 board and Deserializer J7 board to indicate power is applied to the boards 6 Initialize the Deserializer Refer to the DS90UB901Q 902Q datasheet for startup procedure and the definition of each register 7 Verify that LOCK LED on D5 and the RJ45 or...

Страница 5: ... 5 BLOCK DIAGRAMS RJ45 Figure 2 Serializer Board Block Diagram LP2992 1 8 RJ45 16x2 Header 2 I2C PCLK D0 D9 HS VS SERDESUB 16OVT Deserializer DS90UB902Q LM22671 5 0 LP38693 ADJ 12V 5V To Processor Figure 3 Deserializer Board Block Diagram Block Diagrams ...

Страница 6: ...aster controller at the Deserializer side Figure 4 The I2C slave core in the Deserializer will detect if a transaction is intended for the Serializer or the camera sensor slave device at the Serializer Commands are sent over the bidirectional control channel to initiate the transactions The Serializer will receive the command and generate an I2C transaction on its local I2C bus At the same time th...

Страница 7: ...cable connection is good Cycle ON button on Deserializer board All lights on but no image Check that orientation of board connections is correct No image Check that lens cap is removed from camera Power ground input data and input clock are connected correctly but no outputs Check the Power Down pins of both Serializer and Deserializer boards to make sure that the devices are enabled PDB Vdd for o...

Страница 8: ...HDC_0603 11 1 C34 22uF 805 12 1 C40 22uF Radial_Surface_Mount 13 1 C41 0 1uF CAP_0603 14 1 C42 1uF CAP_HDC_0805 15 1 C49 100uF 3216_12_EIA_1206 16 1 C50 0 01uF CAP_HDC_0603 17 2 C54 C62 10uF CAP_HDC_0805 18 4 C65 C66 C67 C68 4 7uF CAP_HDC_0805 19 1 D1 Green_LED 0603 603 20 1 D2 DIODE SCHOTTKY SC_90_SOD_323F 21 2 D3 D4 DIODE SCHOTTKY S_Mini_2P 22 1 D5 Orange_LED 0603 603 23 1 J1 HEADER 16X2 Through...

Страница 9: ...Ohm RES_HDC_0603 48 1 R40 1 0K_open RES_0603 49 1 R42 0ohm RES_HDC_0603 50 1 R43 976_open RES_HDC_0603 51 1 R44 10K RES_HDC_0402 52 1 R45 470K RES_HDC_060 53 2 R47 R51 9 31K RES_HDC_0603 54 2 R48 R52 5 62K RES_HDC_0603 55 2 R49 R53 51K RES_HDC_0603 56 1 R50 0ohm_open RES_HDC_0603 57 2 R58 R59 0 ohm_open RES_0402 58 1 S1 SW DIP 2 Surface_Mount 59 2 S2 S4 SW PUSHBUTTON SPST_NO 60 1 S3 SW DIP 4 CT218...

Страница 10: ...10 SERDESUB 16OVT EVM User s Guide SNLU108 July 2012 8 APPENDIX Serializer and Deserializer PCB Schematics Appendix ...

Страница 11: ...SNLU108 July 2012 SERDESUB 16OVT EVM User s Guide 11 ...

Страница 12: ...12 SERDESUB 16OVT EVM User s Guide SNLU108 July 2012 ...

Страница 13: ...SNLU108 July 2012 SERDESUB 16OVT EVM User s Guide 13 ...

Страница 14: ...14 SERDESUB 16OVT EVM User s Guide SNLU108 July 2012 ...

Страница 15: ...SNLU108 July 2012 SERDESUB 16OVT EVM User s Guide 15 ...

Страница 16: ...ising from the handling or use of the goods Due to the open construction of the product it is the user s responsibility to take any and all appropriate precautions with regard to electrostatic discharge EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES TI currently deals with a variety of cu...

Страница 17: ... All semiconductor products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its components to the specifications applicable at the time of sale in accordance with the warranty in TI s terms and conditions of sale of semiconductor products Testing and other quality control techniques for TI components are used to the exte...

Страница 18: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Texas Instruments SERDESUB 16OVT NOPB ...

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