Schematic, PCB Layout, and Bill of Materials
12
SBOU175 – October 2019
Copyright © 2019, Texas Instruments Incorporated
OPA462EVM
4.4
Bill of Materials
lists the bill of materials (BOM) used for the OPA46xEVM.
Table 3. OPA462EVM BOM
Designator
Quantity
Description
Part Number
Manufacturer
Notes
C1, C4, C11, C15
4
CAP, CERM, 0.1 uF, 450 V, +/- 10%, X7T, 1206_190
C3216X7T2W104K160AA
TDK
C2, C3, C5, C6
4
CAP, AL, 10 uF, 250 V, +/- 20%, SMD
ULR2E100MNL1GS
Nichicon
C8
1
CAP, CERM, 0.1 uF, 25 V, +/- 10%, X7R, 0603
06033C104KAT2A
AVX
D1, D2
2
Diode, TVS, Uni, 90 V, 146 Vc, SMC
5.0SMDJ90A
Littelfuse
D3, D4
2
Diode, Ultrafast, 400 V, 1 A, SMB
MURS140-13-F
Diodes Inc.
H1, H2, H3, H4
4
MACHINE SCREW PAN PHILLIPS 4-40
9900
Keystone
H5, H6, H7, H8
4
2203
Keystone
J1, J2, J11
3
Terminal Block, 2x1, 6.35mm, Green, TH
1714955
Phoenix Contact
J3, J4, J5, J7, J10,
J12
6
Header, 2.54mm, 3x1, Tin, TH
68001-403HLF
FCI
J6, J8, J9
3
BNC Low Profile Elbow Jack, Gold, R/A, TH
5-1634513-1
TE Connectivity
R1, R8, R13
3
RES, 0, 5%, 0.1 W, 0603
RC0603JR-070RL
Yageo
R2, R3
2
RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
CRCW0603100KFKEA
Vishay-Dale
R4
1
RES, 10.0 k, 0.1%, 0.1 W, 0603
RG1608P-103-B-T5
Susumu Co Ltd
R6, R7
2
RES, 0, 5%, 1 W, 2512
RC6432J000CS
Samsung
SH-J1, SH-J2, SH-J3,
SH-J4, SH-J5, SH-J6
6
Shunt, 100mil, Gold plated, Black
881545-2
TE Connectivity
TP1, TP2, TP3, TP4,
TP5, TP6, TP9, TP10,
TP11, TP12, TP13,
TP14, TP15, TP16
14
Test Point, Compact, SMT
5016
Keystone
U1
1
High-Voltage (180-V), High-Current (30-mA) Operational
Amplifier, G = 1 Stable, DDA0008J (SOIC-8)
OPA462IDDAR
Texas Instruments
OPA462IDDA
C7
0
06033C104KAT2A
AVX
Optional-Not installed
C9, C10, C12, C14,
C17, C18
0
Optional-Not installed
C13, C16
0
Optional-Not installed
FID1, FID2, FID3
0
Optional-Not installed
Q1, Q2
0
JFET, 2-CH, N-CH, V, A, SOIC-8
IF1322A
InterFET
Optional-Not installed
R5, R11, R12
0
Optional-Not installed
R9, R10
0
Optional-Not installed