Mechanical Information
7-5
Customer Information
The C614 is sold in die form for its volume production. For software develop-
ment and prototyping, a windowed ceramic 120 pin grid array packaged P614
is available. The P614’s PGA package is shown in Figure 7–2.
Figure 7–2. 120-Pin Grid Array Package for the Development Device, P614
extra pin
1 2 3 4 5 6 7 8 9
N
M
L
K
J
H
G
F
E
D
C
B
A
10 9 8 7 6 5 4 3 2 1
N
M
L
K
J
H
G
F
E
D
C
B
A
(BOTTOM VIEW)
(TOP VIEW)
11
12
13
11 12 13
10
Note:
The PGA package is only available in limited quantities for development
purposes.
Содержание MSP50C614
Страница 1: ...MSP50C614 Mixed Signal Processor User s Guide SPSU014 January 2000 Printed on Recycled Paper ...
Страница 6: ...vi ...
Страница 92: ...3 22 ...
Страница 300: ...Instruction Set Summay 4 208 Assembly Language Instructions ...
Страница 314: ...Software Emulator 5 14 Figure 5 13 Project Menu Figure 5 14 Project Open Dialog ...
Страница 325: ...Software Emulator 5 25 Code Development Tools Figure 5 25 EPROM Programming Dialog ...
Страница 331: ...Software Emulator 5 31 Code Development Tools Figure 5 31 Context Sensitive Help System ...
Страница 368: ...5 68 ...
Страница 394: ...7 12 ...
Страница 400: ...Architecture A 6 Figure A 3 MSP50C605 100 Pin PJM Package MSP50C605 100 PIN PJM PLASTIC PACKAGE 1 80 81 100 30 31 50 51 ...
Страница 402: ...A 8 ...
Страница 412: ...Packaging B 10 ...
Страница 414: ...C 2 C 1 MSP50C605 Data Sheet This appendix contains the data sheet for the MSP50C605 mixed signal pro cessor ...