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Texas Instruments MSP430FR5739, Руководство пользователя

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List of Figures

1

MSP-EXP430FR5739 Overview

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2

Comparing Write Speeds When Writing to Nonvolatile Memory (MSP430FR5739 FRAM vs
MSP430F2274 Flash)

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3

Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps (MSP430FR5739 FRAM vs
MSP430F2274 Flash)

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10

4

On-Board Accelerometer

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On-Board NTC Thermistor

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6

MSP430FR5739 Pin Designation

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7

Schematics (1 of 3)

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Schematics (2 of 3)

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Schematics (3 of 3)

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10

MSP-EXP430FR5739 Top Layer

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11

MSP-EXP430FR5739 Bottom Layer

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MSP-EXP430FR5739 Silkscreen

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List of Tables

1

User Experience Source Files

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13

2

Bill of Materials (BOM)

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21

4

List of Figures

SLAU343B

–

May 2011

–

Revised February 2012

Submit Documentation Feedback

Copyright

©

2011

–

2012, Texas Instruments Incorporated

Содержание MSP430FR5739

Страница 1: ...MSP EXP430FR5739 FRAM Experimenter Board User s Guide Literature Number SLAU343B May 2011 Revised February 2012 ...

Страница 2: ...2 SLAU343B May 2011 Revised February 2012 Submit Documentation Feedback Copyright 2011 2012 Texas Instruments Incorporated ...

Страница 3: ...1 Associated Zip Folder Contents 7 2 2 The User Experience Demo 7 2 3 View Edit or Recompile the User Experience Code Using an IDE 13 3 MSP EXP430FR5739 Hardware 14 3 1 MSP430FR5739IRHA Device Pin Designation 14 3 2 Schematics 15 3 3 PCB Layout 18 3 4 Bill of Materials BOM 21 4 Suggested Reading 22 5 References 22 3 SLAU343B May 2011 Revised February 2012 Table of Contents Submit Documentation Fee...

Страница 4: ...On Board Accelerometer 11 5 On Board NTC Thermistor 12 6 MSP430FR5739 Pin Designation 14 7 Schematics 1 of 3 15 8 Schematics 2 of 3 16 9 Schematics 3 of 3 17 10 MSP EXP430FR5739 Top Layer 18 11 MSP EXP430FR5739 Bottom Layer 19 12 MSP EXP430FR5739 Silkscreen 20 List of Tables 1 User Experience Source Files 13 2 Bill of Materials BOM 21 4 List of Figures SLAU343B May 2011 Revised February 2012 Submi...

Страница 5: ...develop debug and implement prototypes in an efficient manner The MSP430FR5739 device is supported by both IAR Embedded Workbench and Code Compose Studio It is recommended to download the latest version of the IDE from www msp430 com The Quick Start Guide SLAU341 is recommended for users who cannot wait to get started developing with the MSP430FR5739 For all others this MSP EXP430FR5739 FRAM Exper...

Страница 6: ...evice pins for debugging purposes or as socket for adding customized extension Separate power jumpers to measure power to the MSP430 and the RF daughter card 1 4 Connecting the Hardware Connect the MSP EXP430FR5739 to the PC using the enclosed USB cable If the PC has an MSP430 Integrated Development Environment IDE such as Code Composer Studio or IAR Embedded Workbench already installed the driver...

Страница 7: ... are four modes of operation for the User Experience demo 1 High speed FRAM writes 2 Emulating the speed of flash writes 3 Sampling accelerometer data and writing to FRAM 4 Sampling thermistor data and writing to FRAM 2 2 1 Entering and Exiting the Demo Modes Follow these steps to enter and exit the demo modes 1 Press switch S1 for mode selection After you press S1 LED8 through LED5 light up to sh...

Страница 8: ...hat the FRAM scratchpad area does not overlap with the application code Different compilers and optimization settings may impact the placement of the application code If any overlap occurs the application code may be overwritten in Mode 1 which can cause the demo to fail In Mode 1 the system main clock is configured to use the DCO set to 8 MHz A function that performs long word writes to FRAM is c...

Страница 9: ...VCC and GND connection and disconnecting the USB cable from the board In this case the multimeter can be placed in series to VCC by removing the MSP_PWR jumper These recommendations hold true when measuring IDVCC in all four modes 2 2 2 2 Displaying Results on the PC GUI The GUI associated with this document provides details on the time elapsed in the mode number of bytes written speed of FRAM and...

Страница 10: ...s to flash requires nearly 100 duty cycle while writing the same speed to FRAM requires less than 1 duty cycle The rest of the time the FRAM device is in shutdown mode LPM4 which results in an average current of less than 10 µA In comparison for a similar write speed flash based MCUs can require average current up to 2 2 mA Figure 3 Comparing Average Power When Writing to Nonvolatile Memory at 13 ...

Страница 11: ...ther modes Mode 3 also writes the sampled data from the ADC to the FRAM in real time with no wait states or extra cycles spent on setting up the FRAM This can be observed in the ADC interrupt service routine The sampling takes place at more than 15k samples per second At this speed flash devices require that the data be buffered in RAM before writing to flash In FRAM devices the only bottleneck is...

Страница 12: ... 3 Mode 4 also writes the sampled data from the ADC to the FRAM in real time with no wait states or extra cycles spent on setting up the FRAM This can be observed in the ADC interrupt service routine The sampling takes place at more than 15k samples per second At this speed flash devices require that the data be buffered in RAM before writing to flash In FRAM devices the only bottleneck is the spe...

Страница 13: ...ard 4 If multiple emulation tools are connected to your PC click Project Options FET Debugger Connection to explicitly select the experimenter board 2 3 2 Importing the CCS Project for the User Experience Code To import the CCS project for the User Experience demo source code 1 Create a workspace folder 2 Open CCS and point to the newly created workspace folder 3 Click Project Import Existing CCS ...

Страница 14: ...1 0 UCA1RXD UCA1SOMI P2 5 TB0 0 UCA1TXD UCA1SIMO P4 1 P4 0 TB2 0 DVCC DVSS 40 30 10 20 RHA PACKAGE TOP VIEW P1 4 TB0 1 UCA0STE A4 CD4 P1 5 TB0 2 UCA0CLK A5 CD5 MSP430FR5721 MSP430FR5723 MSP430FR5725 MSP430FR5727 MSP430FR5729 MSP430FR5731 MSP430FR5733 MSP430FR5735 MSP430FR5737 MSP430FR5739 PJ 3 TCK CD9 PJ 1 TDI TCLK TB1OUTH MCLK CD7 PJ 2 TMS TB2OUTH ACLK CD8 P3 7 TB2 2 AVSS Not available on MSP430F...

Страница 15: ...VCC EZ_VCC EZ_VCC EZ_VCC EZ_VCC GND GND GND RESET RESET URXD UTXD SCL SDA SBWTCK SBWTCK SBWTDIO SBWTDIO CLK3410 RST3410 BTXD BRXDI BTXDI BRXD EZ_VBUS TEST SBWTCK RST SBWTDIO URTS UDTR UDSR UCTS VCC P2 0 P2 0 P2 1 P2 1 Removed U2 SN75240PW from SBW connections SBW UART I F to Argon SBW UART I F to external Ta rget www ti com MSP EXP430FR5739 Hardware 3 2 Schematics The schematics and PCB layouts fo...

Страница 16: ...1 31 P3 0 32 GND2 28 U3 E0 1 SDA 5 VSS 4 E1 2 WC 7 SCL 6 VCC 8 E2 3 U5 R21 R15 R14 C10 C9 C12 C11 R20 R18 R13 C13 R25 R24 R23 R12 R10 R11 C8 IN1 5 OUT1 8 EN 4 IN2 6 RES 2 OUT2 7 FB 1 GND 3 U2 C7 R8 R9 R19 C6 D1 R22 R17 R16 IO1 3 VCC 1 IO2 5 GND 4 NC 2 VBUS 1 ID 4 D 2 U 2 D 3 GND 5 SHIELD1 S1 SHIELD2 S2 SHIELD3 S3 SHIELD4 S4 EZ_VCC EZ_VCC EZ_VCC EZ_VCC EZ_VCC EZ_VCC SDA SCL UTXD URXD RESET CLK3410 ...

Страница 17: ...MSP_PWR 2 TP8 TP9 TP10 TP11 TP12 TP13 TP15 TP14 R34 R35 NTC C31 1 2 RF_PWR C32 1 2 3 4 5 6 7 8 9 10 11 12 SV1 1 2 3 4 5 6 7 8 9 10 11 12 SV2 C15 C16 C1 7 C53 NC 1 ST 2 COM 3 NC 4 COM 5 COM 6 COM 7 ZOUT 8 NC 9 YOUT 10 NC 11 XOUT 12 NC 13 VS 14 VS 15 NC 16 ACC C58 C18 C19 LED2 LED1 R28 R29 LED4 LED3 R36 R37 R27 R30 R31 R32 LED5 LED6 LED7 LED8 TP16 TP17 LDR 1 2 RST R33 C24 GND GND GND GND GND GND GND...

Страница 18: ...www ti com 3 3 PCB Layout Figure 10 MSP EXP430FR5739 Top Layer 18 MSP EXP430FR5739 FRAM Experimenter Board SLAU343B May 2011 Revised February 2012 Submit Documentation Feedback Copyright 2011 2012 Texas Instruments Incorporated ...

Страница 19: ...0FR5739 Hardware Figure 11 MSP EXP430FR5739 Bottom Layer 19 SLAU343B May 2011 Revised February 2012 MSP EXP430FR5739 FRAM Experimenter Board Submit Documentation Feedback Copyright 2011 2012 Texas Instruments Incorporated ...

Страница 20: ...rdware www ti com Figure 12 MSP EXP430FR5739 Silkscreen 20 MSP EXP430FR5739 FRAM Experimenter Board SLAU343B May 2011 Revised February 2012 Submit Documentation Feedback Copyright 2011 2012 Texas Instruments Incorporated ...

Страница 21: ...1 FR5739 RHA40 15 J3 1 2x05 Pin Header Male 16 J4 1 SL127L6TH 17 J6 1 3 pin header male TH 18 LDR 0 Do not populate 19 LED0 1 LED GREEN 0603 20 LED1 LED8 8 LED BLUE 470NM 0603 SMD 21 MSP_PWR 1 2 pin header male TH 22 NTC 1 100k 23 Q1 1 12MHz 24 Q2 1 Crystal R1 R2 R3 R16 25 4 47k R17 R33 R4 R5 R6 R7 26 4 100R R23 27 R8 1 61k5 28 R12 1 33k 29 R9 1 30K 30 R10 1 10k 31 R11 1 15k 32 R13 R24 R25 3 1k5 3...

Страница 22: ...side view of the CCS and IAR IDEs download the latest version from the MSP430 page and read the included user s guides and documentation in the installation folder Documents describing the IAR tools Workbench C SPY the assembler the C compiler the linker and the library are located in common doc and 430 doc All necessary CCS documents can be found in msp430 doc inside the CCS installation path The...

Страница 23: ...other than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control techniques are used to the extent TI deems necessary TI does not test all parameters of each EVM User s claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects...

Страница 24: ... These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation...

Страница 25: ...y for convenience and should be verified by User 1 Use EVMs in a shielded room or any other test facility as defined in the notification 173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use EVMs only after User obtains the license of Test Radio Station as provided in R...

Страница 26: ... any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees affiliates contractors or designees 4 4 User assumes all...

Страница 27: ...OR DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthermore no return of EVM s will be accepted if the package has been opened and no return of the EVM s will be accepted if they are damaged or otherwise not in a resalable condition If User feels it has...

Страница 28: ...se resources are subject to change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for...

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