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1902C

FID2

DNP

FID1

DNP

FID3

DNP

10µF

C15

GND

TP2

TP3

GND

+VA

+VB

HSP010
A

PCB Number:

PCB Rev:

VCCIO

GND

PWREN#

RD#

USBDP

USBDM

3V3OUT

GND

RESET#

VCC

GND

TXE#

RXF

AGND

TEST

OSCI

OSCO

FT245RL

1
2
3
4
5

J13
USB

47pF

C36

47pF

C37

0.1µF

C38

R20

OUT

GND

DAP

U3
LP5900SD-1.8/NOPB

0.01µF

C39

10µF
16V

C40

R19

10µF
16V

C49

0.1µF

0.01µF

10.0k

R21

22.1

R23

22.1

R24

22.1

R25

22.1

R26

SCLK

SDI

SDO

SCS

ADC_SDO

ADC_SDI

SCLK

GND2

GND

330 ohm

GND2

10.0k

R22

40V

D1
10BQ040TRPBF

TP1

V+

LOGO

PCB

Texas Instruments

NY PMS 440 0025 PH

NFM41PC204F1H3L

Assembly Note

ZZ2

These assemblies are ESD sensitive, ESD precautions shall be observed.

Assembly Note

ZZ3

These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

Assembly Note

ZZ4

These assemblies must comply with workmanship standards IPC-A-610 Class 2., unless otherwise specified.

LOGO

PCB

Pb-Free Symbol

LOGO

PCB

FCC disclaimer

Label Assembly Note

ZZ1

This Assembly Note is for PCB labels only

PCB Label

LBL1

Size: 0.65" x 0.20 "

Label Table

Variant

Label Text

001

LMH2832EVM-50

002

ChangeMe!

LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

www.ti.com

SLOU454 – June 2016

Submit Documentation Feedback

LMH2832EVM-50 Evaluation Module

Figure 6. Schematic - Digital

Содержание LMH2832EVM-50

Страница 1: ...SB to SPI bus translator chip spacer Contents 1 Features 2 2 EVM Specifications 3 3 Evaluation Board Setup Block Diagram 3 4 Setup Procedure 4 4 1 Connect EVM to a 5 V Bench Power Supply 4 4 2 Connect EVM to the External Signal Source at the Input 4 4 3 Connect EVM to the External Test Equipment at the Output 4 4 4 PD Power Down Input 4 4 5 Connect EVM to the PC and LMH2832 EVM GUI Installation 5 ...

Страница 2: ...4 Low Level View Controls 7 5 LMH2832EVM Bill of Materials 19 1 Features The key features of this EVM include Configured for 5 V single supply operation Designed for AC coupled single ended 50 Ω input and output connection Interface to the inputs and outputs using SMA connectors USB connector and FTDI USB to SPI bus translator chip to successfully program the DVGA gain registers Figure 1 shows the...

Страница 3: ...the EVM specifications Table 1 EVM Specifications Parameter Value Vs Single supply voltage range V Ground 4 5 V to 5 25 V GND Ground reference pins Tied to GND or 0 V PDA or PDB Power down PD input voltage GND to Vs Is Supply current with both channels enabled approximately 204 mA IIN Input voltage Vs Max 3 Evaluation Board Setup Block Diagram The following sections help in setting up the LMH2832 ...

Страница 4: ... flexibility in testing at different input frequencies using on board input and output baluns as shown in Figure 2 2 It is recommended to use 6 dB attenuator pads at the input while connecting a 50 Ω signal source to the LMH2832EVM 50 evaluation board SMA inputs 3 TI recommends using a low pass or band pass filter in between the signal source and the evaluation board while measuring the harmonic d...

Страница 5: ...vice registers 8 The DVGA register address and configuration values are found in the LMH2832 device data sheet SBOS709 5 Amplifier Device Register Configuration The LMH2832 channels are programmable via the serial programming interface SPI bus accessible through the FTDI USB to SPI converter chip located on the EVM A GUI is provided to write instructions on the bus and program the registers of the...

Страница 6: ...Descriptions for each of the tabs of the GUI are shown in Table 3 Figure 3 LMH2832 EVM GUI Front Page Table 3 LMH2832 GUI Tab Descriptions Tab Description High Level View Enables control of the LMH2832 features None of these controls need to be touched for basic operation Instead use the Low Level View tab to load configuration files Low Level View Allows write and read access to all device regist...

Страница 7: ...egister at the time the GUI was last updated due to a read or write event Write Register button Write to the register highlighted in the Register Map with the value in the Write Data field This button must be clicked after changing bits in the register data section Read Register button Read from the register highlighted in the Register Map and display the results in the Value column Read All butto...

Страница 8: ... mini USB cable Check to see whether the connectors to power supply pins of the LMH2832 EVM are connected properly and turned ON The nominal supply current for the LMH2832EVM for 5 V supply is approx 204 mA with both the channels enabled Low supply current See if one of the device channels is disabled by the PDA or PDB jumper Also check to see if the power supply is set to the right voltage No sup...

Страница 9: ...µF 0402 C16 VA GND VA GND 1000pF 0402 C28 0 01µF 0402 C29 VA GND VA GND 1000pF 0402 C21 0 01µF 0402 C20 VA GND VA GND 1000pF 0402 C25 0 01µF 0402 C24 VA GND VA GND 1000pF 0402 C18 0 01µF 0402 C19 GND GND VB VB 1000pF 0402 C22 0 01µF 0402 C23 GND GND VB VB 1000pF 0402 C26 0 01µF 0402 C27 GND GND VB VB 1000pF 0402 C30 0 01µF 0402 C31 GND GND VB VB 0603 R32 DNP 0 0603 R3 DNP 0 0603 R4 0 01µF 0603 C3 ...

Страница 10: ...nts H1 NY PMS 440 0025 PH H2 NY PMS 440 0025 PH H3 NY PMS 440 0025 PH H4 NY PMS 440 0025 PH Z2 NFM41PC204F1H3L Z1 NFM41PC204F1H3L Assembly Note ZZ2 These assemblies are ESD sensitive ESD precautions shall be observed Assembly Note ZZ3 These assemblies must be clean and free from flux and all contaminants Use of no clean flux is not acceptable Assembly Note ZZ4 These assemblies must comply with wor...

Страница 11: ...d Bill of Materials 11 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module 7 2 Layer Prints Figure 7 through Figure 14 illustrate the LMH2832EVM layer prints Figure 7 Top Layer ...

Страница 12: ...Schematic Layer Prints and Bill of Materials www ti com 12 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 8 Layer 2 Ground Plane ...

Страница 13: ...LMH2832 EVM Schematic Layer Prints and Bill of Materials 13 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 9 Layer 3 GND Plane ...

Страница 14: ... Schematic Layer Prints and Bill of Materials www ti com 14 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 10 Layer 4 GND Plane ...

Страница 15: ... LMH2832 EVM Schematic Layer Prints and Bill of Materials 15 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 11 Layer 5 V Plane ...

Страница 16: ...chematic Layer Prints and Bill of Materials www ti com 16 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 12 Layer 6 Ground Plane ...

Страница 17: ...LMH2832 EVM Schematic Layer Prints and Bill of Materials 17 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 13 Layer 7 GND Plane ...

Страница 18: ...VM Schematic Layer Prints and Bill of Materials www ti com 18 SLOU454 June 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated LMH2832EVM 50 Evaluation Module Figure 14 Bottom Layer ...

Страница 19: ...H5 H6 H7 H8 4 Standoff Hex 0 5 L 4 40 Nylon Standoff 1902C Keystone J1 J3 J5 J7 J9 J11 6 Connector SMT End launch SMA 50 ohm SMA End Launch 142 0701 851 Emerson Network Power J6 J8 2 Header TH 100mil 2x1 Gold plated 230 mil above insulator TSW 102 07 G S TSW 102 07 G S Samtec Inc J13 1 MINI USB 2 0 SMT TYPE AB 5 CONTACTS R A SMD 9 2x9 9x4 mm 651305142821 Wurth Elektronik eiSos L1 1 330 ohm 1 5A Fe...

Страница 20: ...ce 0603 Used in BOM report Used in BOM report C41 C42 C43 C44 C45 C46 C47 C48 0 CAP CERM xxxF xxV TempCo xx PackageReference 0402 Used in BOM report Used in BOM report FID1 FID2 FID3 0 Fiducial mark There is nothing to buy or mount Fiducial N A N A J2 J4 J10 J12 0 Connector SMT End launch SMA 50 ohm SMA End Launch 142 0701 851 Emerson Network Power R2 R13 R17 R29 R30 R31 R32 R33 R34 R35 R36 0 RES ...

Страница 21: ...ring the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repair such EVM or provide replacements Repaired EVMs shall be warranted for the remainder of the original warranty period Replaced EVMs shall be warranted for a new full ninety 90 day warranty period 3 ...

Страница 22: ... by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes détachables Conformément à la rég...

Страница 23: ... connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the inputs and outputs kept within the specified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors cu...

Страница 24: ...F REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED 8 2 Specific Limitations IN NO EVENT SHALL T...

Страница 25: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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