5 PCB Layout
through
show the board layout for the LM5168FEVM.
The 8-pin SO PowerPAD
™
package offers an exposed thermal pad, which must be soldered to the copper
landing on the PCB for optimal thermal performance. The PCB consists of a 4-layer design. There are 2-oz
copper planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat with an array of thermal
vias under the thermal pad to connect to all four layers.
Figure 5-1. Top Layer
Figure 5-2. Mid-Layer 1 Ground Plane
PCB Layout
LM5168FEVM EVM User's Guide
9
Copyright © 2021 Texas Instruments Incorporated
