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Texas Instruments EV2300 Скачать руководство пользователя страница 7

 Contents

vii

 

Contents

1

Introduction

1-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

1.1

Features

1-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

1.2

Kit Contents

1-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

1.3

Ordering Information

1-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2

Interfaces

2-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2.1

Overview

2-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2.2

EV2300 Controller

2-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2.3

USB Interface (USB)

2-3

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2.4

HDQ Interface (HDQ)

2-3

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2.5

I

2

C/EEPROM Interface (I

2

C)

2-4

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

2.6

SMBus Interface (SMBus)

2-4

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

EV2300 Bill of Materials, Component Placement, and Schematic

3-1

. . . . . . . . . . . . . . . . . . . . 

3.1

Bill of Materials (BOM)

3-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3.2

EV2300 Component Placement

3-4

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3.3

EV2300 Schematic

3-12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

Figures

3

−

1

Board Layer 1

3-4

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

2

Solder Mask 1

3-5

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

3

Solder Mask 2

3-6

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

4

Board Layer 2

3-7

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

5

Component Placement 1

3-8

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

6

Component Placement 2

3-9

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

7

Internal Board Layer 1

3-10

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

3

−

8

Internal Board Layer 2

3-11

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

Tables

1

−

1

Ordering Information

1-2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

Содержание EV2300

Страница 1: ...EV2300 Evaluation Module Interface Board February 2005 PMP EVMs User s Guide SLUU159A ...

Страница 2: ...nt that any license either express or implied is granted under any TI patent right copyright mask work right or other TI intellectual property right relating to any combination machine or process in which TI products or services are used Information published by TI regarding third party products or services does not constitute a license from TI to use such products or services or a warranty or end...

Страница 3: ... handling or use of the goods Please be aware that the products received may not be regulatory compliant or agency certified FCC UL CE etc Due to the open construction of the product it is the user s responsibility to take any and all appropriate precautions with regard to electrostatic discharge EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR A...

Страница 4: ... output If there is uncertainty as to the load specification please contact a TI field representative During normal operation some circuit components may have case temperatures greater than 30 C The EVM is designed to operate properly with certain components above 70 C as long as the input and output ranges are maintained These components include but are not limited to linear regulators switching ...

Страница 5: ...ontains the following chapters Chapter 1 Introduction Chapter 2 Interfaces Chapter 3 EV2300 Bill of Materials Component Placement and Sche matic Information About Cautions and Warnings This document may contain cautions and warnings This is an example of a caution statement A caution statement describes a situation that could potentially damage your software or equipment This is an example of a wa...

Страница 6: ...dling refer to SSYA008 FCC Warning This equipment is intended for use in a laboratory test environment only It gen erates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules which are designed to provide reasonable protection against radio frequency interference Operation of this equip...

Страница 7: ...2C 2 4 2 6 SMBus Interface SMBus 2 4 3 EV2300 Bill of Materials Component Placement and Schematic 3 1 3 1 Bill of Materials BOM 3 2 3 2 EV2300 Component Placement 3 4 3 3 EV2300 Schematic 3 12 Figures 3 1 Board Layer 1 3 4 3 2 Solder Mask 1 3 5 3 3 Solder Mask 2 3 6 3 4 Board Layer 2 3 7 3 5 Component Placement 1 3 8 3 6 Component Placement 2 3 9 3 7 Internal Board Layer 1 3 10 3 8 Internal Board ...

Страница 8: ...Contents viii ...

Страница 9: ...ular platform PC to communicate with Texas Instruments SMBus HDQ or DQ interface gas gauges via a Universal Serial Bus USB port In addition to this board PC software is required to interpret the gas gauge data to complete the evaluation system Topic Page 1 1 Features 1 2 1 2 Kit Contents 1 2 1 3 Ordering Information 1 2 Chapter 1 ...

Страница 10: ...ble of providing a 25 mA 3 3 V source Complete interface between USB and SMBus I2C and HDQ 8 16 inter faces using a simple API 1 2 Kit Contents EV2300 circuit module Standard USB cable 1 3 Ordering Information Table 1 1 Ordering Information EVM Part Number EV2300 ...

Страница 11: ...and SMB SMBus HDQ and DQ Interface ports Terminal block for connecting to a target device I2C E2PROM I2C Interface Terminal for connecting to a target E2PROM or I2C interface battery monitor USB USB Interface Interface to host computer Topic Page 2 1 Overview 2 2 2 2 EV2300 Controller 2 2 2 3 USB Interface USB 2 3 2 4 HDQ Interface HDQ 2 3 2 5 I2C EEPROM Interface I2C 2 4 2 6 SMBus Interface SMBus...

Страница 12: ...ntroller firmware is stored in flash memory and is executed by the core at power up after the boot ROM code verifies the integrity words The controller communicates with target device s through either a 2 wire SMBus communication port a 1 wire HDQ port or a 2 wire E2PROM I2C port The 2 wire SMBus communication port supports both SMBus and I2C protocols ...

Страница 13: ...SB interface IC 3 An EV2300 controller driver for direct access to the device 4 An EV2300 DLL for application access to the device 2 4 HDQ Interface HDQ This interface allows a host computer to interact with a slave or target device through the two wire SMBus or the one wire HDQ interfaces The ports are labeled with the corresponding signal names above each port connector Connect the signal and a ...

Страница 14: ...n Connected to the SMD and HDQ GND 2 SCL I2C clock This line must be pulled up by the target 3 SDA I2C data This line must be pulled up by the target 4 VOUT Controlled EEPROM power Supplies 5 VDC to a target EE PROM IC 2 6 SMBus Interface SMBus Pin Name Description 1 GND Ground reference 2 SMBC SMB clock pin This pin is pulled to 3 3 VDC through a 10 kΩ re sistor Do not exceed 5 6 VDC on this pin ...

Страница 15: ...ials Component Placement Schematic This chapter includes the schematic component placement on the circuit board and a listing of the bill of materials for the EV2300 EVM Topic Page 3 1 Bill of Materials BOM 3 2 3 2 EV2300 Component Placement 3 4 3 3 EV2300 Schematic 3 12 Chapter 3 ...

Страница 16: ...apacitance TVS SOT23 General Semi GL05T 1 J1 Connector USB upstream Type B 0 47 0 67 Molex 67068 1000 3 J13 J15 Header friction lock assembly 4 pin right angle 0 400 x 0 500 Molex 22 05 3041 1 J2 Header 11 pin 100 mil spacing 36 pin strip 121100 Sullins PTC36SAAN 0 J3 J5 J8 J11 Open 0 038 1 J7 Header 2 pin 100 mil spacing 36 pin strip 0 100 2 Sullins PTC36SAAN 1 Q1 Transistor NPN high performance ...

Страница 17: ... ECS 327 8 14 1 N A Plastic enclosure bone Texas Instruments silkscreen PacTec 84107 501 039 Wire Cable Assembly 1 Mate Connector female 0 100 centers 22 01 30 47 Molex 4 N A Terminals crimp tin 08 50 011 4 Molex N A Wire insulated 22 Awg red 18 inches 3 inches VOUT Any Any N A Wire insulated 22 Awg white 18 inches 3 inches SCL Any Any N A Wire insulated 22 Awg black 18 inches 3 inches GND Any Any...

Страница 18: ...EV2300 Component Placement 3 4 3 2 EV2300 Component Placement Figure 3 1 Board Layer 1 ...

Страница 19: ...EV2300 Component Placement 3 5 EV2300 Bill of Materials Component Placement Schematic Figure 3 2 Solder Mask 1 ...

Страница 20: ...EV2300 Component Placement 3 6 Figure 3 3 Solder Mask 2 ...

Страница 21: ...EV2300 Component Placement 3 7 EV2300 Bill of Materials Component Placement Schematic Figure 3 4 Board Layer 2 ...

Страница 22: ...EV2300 Component Placement 3 8 Figure 3 5 Component Placement 1 ...

Страница 23: ...EV2300 Component Placement 3 9 EV2300 Bill of Materials Component Placement Schematic Figure 3 6 Component Placement 2 ...

Страница 24: ...EV2300 Component Placement 3 10 Figure 3 7 Internal Board Layer 1 ...

Страница 25: ...EV2300 Component Placement 3 11 EV2300 Bill of Materials Component Placement Schematic Figure 3 8 Internal Board Layer 2 ...

Страница 26: ...EV2300 Schematic 3 12 3 3 EV2300 Schematic ...

Страница 27: ...1 IN 4 NC FB 5 OUT 2 GND 3 EN ...

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