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Design Documentation

www.ti.com

7.3

PCB Layers

Gerber files are available for download at the DRV632EVM product folder page on the TI Web site.
Component placement and board layout are illustrated in

Figure 8

,

Figure 9

, and

Figure 10

, respectively.

NOTE:

Board layouts are not to scale. These figures are intended to show how the board is laid

out; they are not intended to be used for manufacturing DRV632EVM PCBs.

Figure 8. DRV632EVM PCB Component Placement

Figure 9. DRV632EVM PCB Top Layer

10

DRV632EVM Evaluation Module

SLOU301 – January 2010

Submit Documentation Feedback

© 2010, Texas Instruments Incorporated

Содержание DRV632EVM

Страница 1: ...VM Top View 2 2 DRV632EVM Bottom View 2 3 DRV632EVM Functional Block Diagram 3 4 Power Up Down Sequence 5 5 Second Order Active Low Pass Filter 6 6 Differential Input Second Order Active Low Pass Filt...

Страница 2: ...e has differential inputs and uses external gain setting resistors that support a gain range of 1 V V to 10 V V and line outputs that have 8 kV IEC electrostatic discharge ESD protection The DRV632 al...

Страница 3: ...parts list and PCB layout design Gerber layout files are available from the TI Web site at www ti com Throughout this document the abbreviation EVM and the term evaluation module are synonymous with t...

Страница 4: ...n Failure to observe proper ESD handling procedures may result in damage to EVM components 2 2 Unpacking the EVM On opening the DRV632EVM package ensure that the following items are included One DRV63...

Страница 5: ...best option Placing this decoupling capacitor close to the DRV632 device is important for amplifier performance For filtering lower frequency noise signals a 10 mF or greater capacitor placed near th...

Страница 6: ...ng capacitor With the proposed values of 15 k 30 k and 43 k a dynamic range DYR of 102 dB can be achieved with a small 2 2 mF input ac coupling capacitor The MFB filter structure demands an operationa...

Страница 7: ...ecoupling capacitor in order to facilitate proper device operation If the GND pins are connected directly to each other the device functions without risk of failure but noise and THD performance can b...

Страница 8: ...SOP14 PW U1 14 13121110 9 8 7 6 5 4 3 2 1 10K 0603 R21 3 3V 100pfd 50V 0603 C13 GND Orange MUTE R20 0603 30 0K R19 0603 43 0K C12 0603 47pfd 50V JP3 2 1 GND C9 0603 47pfd 50V R8 0603 30 0K GND GND 47p...

Страница 9: ...1 10W ROHS PANASONIC ERJ 3GEYJ103V 4 R6 R7 R9 R11 RESISTOR SMD0603 15 0K 1 1 10W ROHS STACKPOLE ELECTRONICS RMCF0603FT15K0 4 R16 R19 RESISTOR SDM0603 20 0K 1 THICK FILM 1 16W ROHS YAGEO RC0603FR 0743...

Страница 10: ...igure 8 Figure 9 and Figure 10 respectively NOTE Board layouts are not to scale These figures are intended to show how the board is laid out they are not intended to be used for manufacturing DRV632EV...

Страница 11: ...www ti com Design Documentation Figure 10 DRV632EVM PCB Bottom Layer 11 SLOU301 January 2010 DRV632EVM Evaluation Module Submit Documentation Feedback 2010 Texas Instruments Incorporated...

Страница 12: ...oduct This notice contains important safety information about temperatures and voltages For additional information on TI s environmental and or safety programs please contact the TI application engine...

Страница 13: ...h statements TI products are not authorized for use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury...

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