Texas Instruments DEM-OPA-SC-1A-EVM, Руководство пользователя, Страница: 3 / 10

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3 SBOU232 – October 2019
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DEM-OPA-SC-1A-EVM Evaluation Module
3 Components
Components that have RF performance similar to the ones in Table 1 may be substituted.
Table 1. Component Descriptions
PART DESCRIPTION
C
1
, C
4
2.2
μ
F, 16 V, Size 3548
C
2
, C
3
0.1 μ F, 50 V, Size 1206
C
1
Feedback capacitor (optional); depends on the application (not used on current
feedback op amps)
R
5
, R
7
, R
8
Typically 50 Ω
R
1
, R
3
, R
4
, R
6
Depends on the application, used for impedance matching or inverting operation
J
5
Power down, Enable jumper
J
2
– J
4
, J
6
SMA or SMB connectors
4 Board Layout
This demonstration fixture is a two-layer PCB with the power traces on the bottom layer. Even though both
sides have a ground plane, a window has been opened up around the DUT and its surrounding
components. The purpose of this window is to reduce the parasitic capacitances between sensitive nodes
and the ground planes. The footprint of the SMA connectors were designed to use straight connectors in
either a vertical or horizontal mounting position. Note that the center conductor of the SMA must be on the
top side of the board when mounted horizontally.
Figure 3. DEM-OPA-SC-1A Top Silkscreen Figure 4. DEM-OPA-SC-1A Top Layer
Figure 5. DEM-OPA-SC-1A Bottom Layer Figure 6. DEM-OPA-SC-1A Bottom Silkscreen