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Test Setup

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4

Test Setup

4.1

Test Equipment

Voltage source VIN:

The input voltage source VIN must be a 0-V to 20-V variable DC source capable of

supplying 10 ADC. Connect VIN to J303 (as shown in

Figure 3

).

Voltage source V5VIN:

The input voltage source V5VIN must be a 0-V to 5-V variable DC source

capable of supplying 1 ADC. Connect V5VIN to J301 (as shown in

Figure 3

).

Multimeters:

V1: VIN at TP304 (Vins) and TP305 (GNDS)

V2: 5V at TP301 (5V) and TP302 (GND)

V3: Vouts at TP308 (Vouts) and TP309 (GNDS)

A1: VIN input current

A2: V5VIN input current

Output load:

The output load must be an electronic constant-resistance mode load capable of 0-ADC to

30-ADC at 1.0 V.

Oscilloscope:

A digital or analog oscilloscope can be used to measure the switch node waveform.

Differential probe must be used for the switch node waveform measurements. The oscilloscope should be
set for 50-

Ω

impedance, 1-GHz bandwidth, DC coupling, 50-ns/division horizontal resolution, 5-V/division

vertical resolution. When measuring the switch node waveform, place the negative probe tip on the GND
pad of the input cap and positive tip on the CSD87588N Vsw top metal (as shown in

Figure 2

).

Figure 2. Tip and Barrel Measurement for Vsw Waveform

Fan:

TI recommends a small fan capable of 200 to 400 LFM to reduce component temperatures while the

EVM is operating. The fan needs to run when load current is higher than 20 A.

Recommended Wire Gauge:

1. VIN to J303 (8-V to 20-V input):

The recommended wire size is 1x AWG number 14 per input connection, with the total length of wire
less than 4 ft (2 ft input, 2 ft return).

2. V5VIN to J301 (5-V input):

The recommended wire size is 1x AWG number 18 per input connection, with the total length of wire
less than 4 ft (2 ft input, 2 ft return).

3. J304 to LOAD:

The minimum recommended wire size is 2x AWG number 14, with the total length of wire less than 4 ft
(2 ft output, 2 ft return).

4

High Power Density, Low Profile NexFET™ Power Block II for Notebook

SLPU002A – February 2014 – Revised February 2014

Power Supply

Submit Documentation Feedback

Copyright © 2014, Texas Instruments Incorporated

Содержание CSD87588N

Страница 1: ...CSD87588NEVM 603 Schematic 3 2 Tip and Barrel Measurement for Vsw Waveform 4 3 CSD87588NEVM 603 Recommended Test Setup 5 4 Efficiency versus Output Current for CSD87588N 7 5 Switching Node Waveform V...

Страница 2: ...ns Table 1 CSD87588NEVM 603 Electrical Performance Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT CHARACTERISTICS VIN voltage 12 20 V Voltage range 5V voltage 4 5 5 5 5 V OUTPUT CHARA...

Страница 3: ...GND 7 PGND 8 V5 9 DL 10 DH 11 SW 12 BST 13 EN 14 MODE 15 PGOOD 16 PWPD 17 U300 TPS51219RTE DNP C307 DNP R305 TP309 330 F C308 330 F C309 10 F C310 0 R306 2 2R R307 GSNS_300 5VIN_300 VSNS_300 2 2 F C31...

Страница 4: ...ution 5 V division vertical resolution When measuring the switch node waveform place the negative probe tip on the GND pad of the input cap and positive tip on the CSD87588N Vsw top metal as shown in...

Страница 5: ...or to connecting the DC source V5VIN TI recommends to limit the source current from 5V to 0 5 A maximum Ensure that V5VIN is initially set to 0 V and connected as shown in Figure 3 3 Connect a voltmet...

Страница 6: ...tion 9 Decrease load to 0 A 10 Put a jumper to short J302 to disable the controller 11 Decrease V5VIN to 0 V 12 Decrease VIN to 0 V 5 2 List of Testpoints Table 2 Function of Each Testpoint Testpoints...

Страница 7: ...typical performance curves for CSD87588NEVM 603 1 Efficiency at VO 1 0 V fSW 300 kHz LO 0 36 H TA 25 C Figure 4 Efficiency versus Output Current for CSD87588N Figure 5 Switching Node Waveform Figure...

Страница 8: ...was designed using a six layer 1 oz copper circuit board Figure 7 CSD87588NEVM 603 Top Layer Assembly Drawing Top View Figure 8 CSD87588NEVM 603 Bottom Assembly Drawing Bottom View 8 High Power Densit...

Страница 9: ...op Copper Top View Figure 10 CSD87588NEVM 603 Internal Layer 1 Top View 9 SLPU002A February 2014 Revised February 2014 High Power Density Low Profile NexFET Power Block II for Notebook Power Supply Su...

Страница 10: ...rnal Layer 2 Top View Figure 12 CSD87588NEVM 603 Internal Layer 3 Top View 10 High Power Density Low Profile NexFET Power Block II for Notebook SLPU002A February 2014 Revised February 2014 Power Suppl...

Страница 11: ...ternal Layer 4 Top View Figure 14 CSD87588NEVM 603 Bottom Copper Top View 11 SLPU002A February 2014 Revised February 2014 High Power Density Low Profile NexFET Power Block II for Notebook Power Supply...

Страница 12: ...08mm Technology 1 L301 0 36uH Inductor 36UH 30A POWER CHOKE 11 7 X 10 0 X ETQP4LR36AFC Panasonic SMD H4 0mm 1 Q301 CSD87588N NANO MPA0005A CSD87588N Texas Instruments 1 R301 10K RES 10 0K OHM 1 16W 1...

Страница 13: ...he jumper numbers 4 Updated Figure 2 4 Updated Figure 7 8 Updated Figure 8 8 NOTE Page numbers for previous revisions may differ from page numbers in the current version 13 SLPU002A February 2014 Revi...

Страница 14: ...ing the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repa...

Страница 15: ...transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indic...

Страница 16: ...ified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors current sens...

Страница 17: ...REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE L...

Страница 18: ...sponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related inf...

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