Figure
6
‐
2:
BOOSTXL
‐
CC3120MOD
Bottom
Layer
6.2
General
Layout
Recommendations
Ensure
that
the
following
general
layout
recommendations
are
followed:
Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
Do
not
run signal traces underneath the module on a layer where the module is mounted.
RF traces must have 50-
Ω
impedance.
RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.
RF traces must
not
have sharp corners.
There must be no traces or ground under the antenna section.
RF traces must have via stitching on the ground plane beside the RF trace on both sides.
RF traces must be as short as possible. The antenna, RF traces, and the module must be on the
edge of the PCB product in consideration of the product enclosure material and proximity.
