Texas Instruments CC2564BRVMT, Руководство пользователя, Страница: 3 / 23

1 Introduction
The CC2564MODNEM evaluation board contains the CC2564MODN device. TI intends the board for evaluation
and design purposes. For a complete evaluation solution, the CC2564MODNEM board plugs directly into the
following TI hardware development kits:
• MSP-EXP430F5529
• MSP-EXP430F5438
• DK-TM4C123G
• DK-TM4C129X
• Other MCU
A certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430 ™ and
TM4C12x MCUs. The CC2564MODNEM hardware design files (schematics, layout, and bill of materials [BOM])
are provided as a reference to aid in the implementation of the CC2564MODN device.
2 Features
• Features a CC2564MODN device (MOE package)
• Supports
Bluetooth Specification v4.1
• Supports dual-mode – Bluetooth + Bluetooth low energy
• Offers class 1.5-transmit power (+10 dBm)
• Offers high sensitivity (–93 dBm typical)
• Offers a 32.768-kHz oscillator
• Offers a UART interface – control and data
• Offers a PCM/I2S interface – voice and audio
• Offers 4-layer PCB design
• Offers 1.8 LDO (LP2985-18)
• Offers three voltage level translators (SN74AVC4T774)
• Offers a chip antenna (LTA-5320-2G4S3-A1)
• Offers a RF connector (U.FL-R-SMT-1)
• Offers EM connectors that plug directly into the following TI hardware development kits:
– MSP-EXP430F5529
– MSP-EXP430F5438
– DK-TM4C123G
– DK-TM4C129X
– Other MCU
• Offers COM connectors that plug directly into the TI hardware development kits
• Features Certified and royalty-free TI dual-mode
Bluetooth stack (TIBLUETOOTHSTACK-SDK):
– MSP430 ™ (CC256XMSPBTBLESW)
– TM4C (CC256XM4BTBLESW)
– Other MCU (CC256XSTBTBLESW)
www.ti.com Introduction
SWRU390A – AUGUST 2014 – REVISED AUGUST 2021
Submit Document Feedback
Dual-Mode Bluetooth ® CC2564 Module Evaluation Board 3
Copyright © 2021 Texas Instruments Incorporated