CC1000
SWRS048A Page 50 of 55
Vertical cross section (UltraCSP™)
A
A
h2
h1
Die
Die
PCB mounting pads
Solder bumps (Pb free)
Before assembly on PCB:
After assembly on PCB:
Die thickness
(
A
)
Bump height
before
assembly (
h1
)
Bump height
after assembly
(
h2
)
Total height
before
assembly
Total
height after
assembly
432um 200um
+/- 20um
140um
+/- tbd um
632um
+/- 20um
572um
+/- tbd um
Table 14: Height budget