SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015
4
Specifications
4.1
Absolute Maximum Ratings
(1)
PARAMETER
MIN
MAX
UNIT
CONDITION
All supply pins must have the same
Supply voltage, VDD
–0.3
5.0
V
voltage
VDD + 0.3,
Voltage on any pin
–0.3
V
max 5.0
Input RF level
10
dBm
Package body temperature
260
°C
Norm: IPC/JEDEC J-STD-020
(2)
Humidity non-condensing
5%
85%
Storage temperature range, T
stg
–50
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under general characteristics is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD_020 “Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State Surface Mount Devices”.
4.2
ESD Ratings
VALUE
UNIT
All pads except RF
±1
kV
Human Body Model (HBM), per
Electrostatic discharge (ESD)
ANSI/ESDA/JEDEC JS001
(1) (2)
V
ESD
RF Pads
±0.4
kV
performance:
Charged-device Model (CDM)
250
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2)
According to JEDEC STD 22, method A114, Human Body Model
4.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
CONDITION
402
470
MHz
Programmable in < 300 Hz steps
RF Frequency Range
804
960
MHz
Programmable in < 600 Hz steps
Operating ambient temperature range
–40
85
°C
The same supply voltage should be used for digital
(DVDD) and analog (AVDD) power.
Supply voltage
2.3
3.0
3.6
V
A 3.0 ±0.1 V supply is recommended to meet the
ARIB STD-T67 selectivity and output power tolerance
requirements.
Copyright © 2006–2015, Texas Instruments Incorporated
Specifications
7
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