bq500414QEVM-629 Assembly Drawings and Layout
7
bq500414QEVM-629 Assembly Drawings and Layout
through
show the design of the bq500414QEVM PCB. The EVM has been designed
using a 4-layer, 2-oz, copper-clad circuit board 15.24 cm × 13.335 cm, but components fit into an 8-
cm × 5.0-cm area on the top side. All parts are easy to view, probe, and evaluate the bq500414Q control
IC in a practical application. Moving components to both sides of the PCB or using additional internal
layers offers additional size reduction for space-constrained systems. Gerber files are available for
download from the EVM product folder.
A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer
PCB presents a high risk of poor performance. Grounding between the bq500414Q GND EPAD, pin 47,
36, and 32 and filter capacitor returns C19, C1, C5, and C3 should be a good low-impedance path.
Coil Grounding
– A ground plane area under the coil is recommended to reduce noise coupling into the
receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point
back to the circuit area.
Note:
The clear plastic cover thickness (0.093 in or 2.4 mm) is the z-gap thickness for the transmitter.
Components marked ‘DNP’ should not be populated, and may not be listed in the bill of materials.
Figure 6. Assembly Top
16
bq500414Q bqTESLA Wireless Power TX EVM
SLVUA40A – March 2014 – Revised January 2015
Copyright © 2014–2015, Texas Instruments Incorporated