Texas Instruments BQ77207, Руководство пользователя

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4 BQ77207EVM Circuit Module Physical Construction
This section contains the PCB layout, bill of materials, and schematic of the BQ77207EVM circuit module.
The BQ77207EVM consists of one circuit module assembly, BMS055.
4.1 Board Layout
The BQ77207EVM circuit module is a 2.2-inch × 2.2-inch 2-layer circuit card assembly. It is designed for easy
assembly with cell connections on the left edge to a terminal block. Output terminals are on the right edge using
a header. The EVM layout and construction allows easy understanding of the connections and access to the test
points for evaluation.
See additional information in the configuration and operation sections of this document. Figure 4-1 to Figure 4-6
show the board layout.
Figure 4-1. Top Silk Screen
Figure 4-2. Top Assembly
Figure 4-3. Top Layer
BQ77207EVM Circuit Module Physical Construction www.ti.com
8 BQ77207 Evaluation Module SLUUCI0 – OCTOBER 2021
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