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bq50002AEVM-607 Assembly Drawings and Layout
18
SLUUBJ2 – October 2016
Copyright © 2016, Texas Instruments Incorporated
bq50002A Wireless Power TX EVM
8
bq50002AEVM-607 Assembly Drawings and Layout
through
show the design of the bq50002EVM PCB. The EVM has been designed using
a 4-layer, 2-oz, copper-clad circuit board, 13.2 cm × 7.24 cm with all components in a 4.0-cm x 5.0-cm
active area on the top side and all active traces on the top and bottom layers to allow the user to easily
view, probe, and evaluate bq50002A analog frontend IC and bq500511A control IC in a practical
application. Moving components to both sides of the PCB or using additional internal layers offers
additional size reduction for space-constrained systems. Gerber files are available for download from the
EVM product folder (
).
A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer
PCB presents a high risk of poor performance. Grounding between the bq50002A GND pins and filter
capacitor returns should be a good low-impedance path.
Coil Grounding
– A ground plane area under the coil is recommended to reduce noise coupling into the
receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point
back to the circuit area.
Note:
The clear plastic cover thickness (0.93 in or 2.4 mm) is the z-gap thickness for the transmitter.
Figure 7. Assembly Top