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BILL OF MATERIALS (BOM), LAYOUT, AND SCHEMATIC
6.1
Bill of Materials
lists the bill of materials for the ADS131E08.
Table 10. ADS131E08 Bill of Materials
Item
Qty
Ref Des
Description
Manufacturer
Part Number
1
1
N/A
Printed Circuit Board
TI
6527354
2
15
C1, C2, C3, C4, C5, C6, C11, C17, C39,
CAP CER 1UF 25V 10% X5R 0603
Murata
GRM188R61E105KA12D
C40, C41, C44, C50, C68, C69
3
0
C7, C8, C15, C19, C26, C28, C30, C32,
Not Installed
C33, C34, C35, C36, C48, C54, C59
4
1
C9
CAP CER 22UF 6.3V 10% X5R 0805
Taiyo Yuden
JMK212BJ226KG-T
5
11
C10, C37, C38, C42, C43, C46, C47, C52,
CAP CER 10UF 10V 10% X5R 0805
Murata
GRM219R61A106KE44D
C53, C57, C58
6
10
C12, C13, C14, C16, C18, C49, C61, C62,
CAP CER 0.1UF 50V 10% X7R 0603
Murata
GRM188R71H104KA93D
C75, C76
7
16
C20, C21, C22, C23, C24, C64, C65, C66,
CAP CER 470PF 50V C0G 5% 0603
TDK
C1608C0G1H471J
C67, C70, C71, C72, C73, C74, C77, C78
8
0
C25, C27, C29
Not Installed
9
0
C31
Not Installed
10
4
C45, C51, C55, C56
CAP CER 2.2UF 6.3V 10% X5R 0603
Murata
GRM185R60J225KE26D
11
2
C60, C63
CAP CER 100UF 10V 20% X5R 1210
Taiyo Yuden
LMK325BJ107MM-T
12
0
D1–D16
Not Installed
13
1
J1 (Top side)
10 Pin, Dual Row, SM Header (20 Pos.)
Samtec
TSM-110-01-T-DV-P
14
1
J1, J2 (Bottom side)
10 Pin, Dual Row, SM Header (20 Pos.)
Samtec
SSW-110-22-F-D-VS-K
15
1
J3 (Bottom side)
5 Pin, Dual Row, SM Header (10 Pos.)
Samtec
SSW-105-22-F-D-VS-K
16
0
J4
Not Installed
17
8
J5–J12
TERMINAL BLOCK 3.5MM 2POS PCB
On Shore
ED555/2DS
18
8
JP1, JP5–JP11
3 Position Jumper _ .1" spacing
Samtec
TSW-103-07-T-S
19
0
JP2
Not Installed
20
2
JP3, JP4
2 Position Jumper _ .1" spacing
Samtec
TSW-102-07-T-S
21
0
JP12
Not Installed
22
5
L1–L5
FERRITE BEAD 470 OHM 0805
Taiyo Yuden
BK2125HM471-T
23
5
R1, R67, R68, R69, R70
RES 0.0 OHM 1/10W 5% 0603 SMD
Yageo
RC0603JR-070RL
24
20
R2, R3, R4, R7, R10, R13, R16, R19, R22,
RES 10.0K OHM 1/10W 1% 0603 SMD
Yageo
RC0603FR-0710KL
R25, R28, R31, R34, R37, R40, R43, R46,
R49, R63, R71
30
Performance Demonstration Kit for the ADS131E08
SBAU200 – June 2012
Copyright © 2012, Texas Instruments Incorporated
Содержание ADS131E08
Страница 33: ...Top Assembly Top Layer...
Страница 34: ...Internal Layer 1 Internal Layer 2...
Страница 35: ...Bottom Layer Bottom Assembly...