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7 Bill of Materials, Schematics, and Layout
This section contains the ADS127L11EVM bill of materials, PCB layout, and the EVM schematics.
7.1 Bill of Materials
lists the bill of materials for the ADS127L11EVM.
Table 7-1. Bill of Materials
Designator
Quantity
Value
Description
Package
Reference
Part Number
Manufacturer
!PCB1
1
Printed Circuit
Board
DC105
Any
C1, C4, C7, C9,
C13, C16, C21,
C22, C27, C33,
C37, C41, C46,
C55
14
0.1uF
CAP, CERM, 0.1
uF, 25 V, +/- 5%,
X7R, 0603
0603
C0603C104J3RA
CTU
Kemet
C2, C23, C24,
C34, C39, C45
6
10uF
CAP, CERM, 10
µF, V,+/- 10%,
X7R, 0805
0805
GRM21BR71A106
KA73L
MuRata
C3, C49
2
22uF
CAP, CERM, 22
µF, 25 V,+/- 10%,
X7R, 1210
1210
CL32B226KAJNF
NE
Samsung Electro-
Mechanics
C5, C25, C31,
C40, C44
5
1uF
CAP, CERM, 1
µF, 16 V,+/- 10%,
X7R, AEC-Q200
Grade 1, 0603
0603
CGA3E1X7R1C10
5K080AC
TDK
C6, C8, C10, C11,
C12, C15, C42,
C43, C50, C51,
C53, C54
12
1uF
CAP, CERM, 1 uF,
25 V, +/- 10%,
X7R, 0603
0603
C0603C105K3RA
CTU
Kemet
C14, C17, C48,
C52, C56
5
10uF
CAP, CERM, 10
uF, 25 V, +/- 10%,
X7R, 1206_190
1206_190
C1206C106K3RA
CTU
Kemet
C19, C35, C47
3
0.033uF
CAP, CERM,
0.033 µF, 50 V,+/-
5%, C0G/NP0,
AEC-Q200 Grade
1, 0805
0805
CGA4J2C0G1H33
3J125AA
TDK
C26, C32
2
1000pF
CAP, CERM, 1000
pF, 25 V,+/- 1%,
C0G/NP0, 0603
0603
C0603C102F3GA
CTU
Kemet
C30, C38, C57
3
0.01uF
CAP, CERM, 0.01
µF, 25 V,+/- 1%,
C0G/NP0, 0603
0603
C0603C103F3GA
CTU
Kemet
D1, D2
2
16V
Diode, Zener, 16
V, 500 mW,
SOD-123
SOD-123
MMSZ4703T1G
ON
Semiconductor
D3
1
Green
LED, Green, SMD
LED_0805
APT2012LZGCK
Kingbright
D4, D5, D6
3
5.6V
Diode, Zener, 5.6
V, 500 mW,
SOD-123
SOD-123
MMSZ4690T1G
ON
Semiconductor
D7
1
3V
Diode, Zener, 3
V, 500 mW,
SOD-123
SOD-123
MMSZ4683T1G
ON
Semiconductor
H1
1
Cable, USB-A to
micro USB-B, 1 m
- Kitting item
102-1092-
BL-00100
CnC Tech
H2, H3
2
Machine Screw
Pan PHILLIPS M3
RM3X4MM 2701
APM HEXSEAL
Bill of Materials, Schematics, and Layout
SBAU351 – APRIL 2021
ADS127L11EVM-PDK Evaluation Module
21
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