566 manual
Version 3 – March 2006
Part # 74410
Printed in USA
56
HARDWARE INFORMATION
The transceiver comprises 16 printed circuit
board subassemblies plus one optional
subassembly, as Figure 5-1 shows:
Figure 5-1 ORION II Subassemblies
Part #
Name
Designator
81908
Input/Output Board
(I/O)
A0
81909
Low Pass Filter
(LPF)
A1
81993
Power Amplifier
(PA)
A2
81906
RF Converter
(RFCNV)
A3
81999
9 MHz IF (IF)
A4
82002
I.F. Converter
(IFCNV)
A5
81907
Subreceiver (SUB)
A6
81995
Logic and DSP
(DSP)
A7
82019
Keypad (KEY)
A8
81936
Power Distribution
Board (PWR)
A9
81912
Synthesizer
(SYNTH)
A10
81916
Motherboard (MBD)
A11
82018
Rear Connector
Board
A12
81957
Sweep Amplifier
A13
81986
82017
optional Autotuner
Audio board
A14
Audio
See Figure 5-2 for a block diagram showing
the relationship of these subassemblies in the
transceiver. A11, the motherboard, forms
ORION II’s central electrical spine
interconnecting all but two of the printed
circuit boards (PCBs). For clarity, the block
diagram does not explicitly show A11’s
myriad interconnections. Miniature coaxial
cable and connectors carry essentially all
signals between boards. Shield partitions
suppress possible inter-board crosstalk.
Subassembly Location
The centrally located motherboard (A11)
connects the logic board (A7), keypad board
(A8), and other front panel parts with the I/O
(A0) and rear connector (A12) boards which
populate the rear panel. Along the way, A11
picks up DC and control line connections
from A1, A4, A5, and A6 in 4 compartments
above the chassis deck. Below the chassis
deck, A3, A9, and A10 also connect to the
Motherboard. The optional internal automatic
antenna tuner (A14) connects via wires and
plug-in cables to A0. Each signal-processing
module has its own compartment. Figure
5-3
maps the physical locations of these
subassemblies in ORION‘s chassis.
A0 and A2 share the rear panel space, with
each taking up most of the height and about
half the width of the panel. The rear
connector board (A12) shares the panel half
dominated by the PA. It carries 5 connectors
whose design suits them to mounting on a
board perpendicular to the panel. Together
with 19 connectors on A0, they comprise
almost all of ORION’s input/output
connectors for DC, audio, control, and RF.
The MIC, CW, and PH (headphone) jacks
are in front.
Signal Path – Main Receiver
Figure 5-4 diagrams the path a main receiver
RF signal takes from antenna to audio.
A signal from one of ORION’s 3 antennas
enters one of the antenna jacks on the rear
panel, where I/O (A0) selects the path to the
RFCNV (A3) via cable 2. Amateur band
preselection, pre-amplification, and high
dynamic range conversion to the first IF take
place in the RF converter.
From A3, cable 11 brings the IF signal to the
9-MHz IF (A4), where the hardware noise
blanker operates in a wideband environment.
Cables 14A and 14B route the wideband IF
signal through the sweep amplifier (A13) to
A7 for use in ORION’s band scope feature.
Four standard and three optional crystal
filters (selected automatically by the BW
control or manually in the menu system)
define the tuned signal bandwidth ahead of
Содержание ORION II
Страница 58: ...566 manual Version 3 March 2006 Part 74410 Printed in USA 58 Figure 5 2 Subassembly Cabling...
Страница 59: ...566 manual Version 3 March 2006 Part 74410 Printed in USA 59 Figure 5 3 Plan View of ORION Chassis...
Страница 60: ...566 manual Version 3 March 2006 Part 74410 Printed in USA 60 Figure 5 4 Main Receiver Signal Path...
Страница 61: ...566 manual Version 3 March 2006 Part 74410 Printed in USA 61 Figure 5 5 Subreceiver Signal Path...
Страница 62: ...566 manual Version 3 March 2006 Part 74410 Printed in USA 62 Figure 5 6 Transmit Signal Path...