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ZE60-2.4 RF module User Guide

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 35 of 45

1vv0300844

Rev.2 – 24/08/2010

VI.4.

Antenna connection on Printed Circuit Boards

Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance
is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables
below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to
the signal line.

PCB material

PCB thickness H (mm)

Coplanar line W (mm)

Coplanar line G (mm)

0.8 1 0.3

FR4

1.6 1 0.2

Table 1 :

Values for double face PCB with ground plane around and under coplanar wave guide (recommended)

PCB material

PCB thickness H (mm)

Coplanar line W (mm)

Coplanar line G (mm)

0.8 1 0.22

FR4

1.6 1 0.23

Table 2 : Values for simple face PCB with ground plane around coplanar wave guide

(not recommended)

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Содержание ZE60-2.4

Страница 1: ...ZE60 2 4 RF Module User Guide 1vv0300844 Rev 2 24 08 2010 ...

Страница 2: ...RF module User Guide Reproduction forbidden without Telit Communications S p A written authorization All Rights Reserved page 2 of 45 1vv0300844 Rev 2 24 08 2010 This document is related to the following product ...

Страница 3: ... injury loss or damage of any kind incurred by use of or reliance upon the information Telit disclaims any and all responsibility for the application of the devices characterized in this document and notes that the application of the device must comply with the safety standards of the applicable country and where applicable with the relevant wiring rules Telit reserves the right to make modificati...

Страница 4: ...L CHARACTERISTICS 14 III 2 MECHANICAL DIMENSIONS 15 III 3 DC CHARACTERISTICS 16 III 4 FUNCTIONAL CHARACTERISTICS 17 III 5 DIGITAL CHARACTERISTICS 19 III 6 ABSOLUTE MAXIMUM RATINGS 19 III 7 ORDERING INFORMATION 20 CHAPTER IV TECHNICAL DESCRIPTION 21 IV 1 PIN OUT OF THE SMD MODULE 21 IV 2 PIN OUT OF THE DIP MODULE 23 IV 3 CORRESPONDENCE 24 IV 4 DESCRIPTION OF THE SIGNALS 25 CHAPTER V PROCESS INFORMA...

Страница 5: ...8 2010 VI 3 RF LAYOUT CONSIDERATIONS 34 VI 4 ANTENNA CONNECTION ON PRINTED CIRCUIT BOARDS 35 VI 5 ZE60 2 4 INTERFACING 36 CHAPTER VII ANTENNA CONSIDERATIONS 39 VII 1 ANTENNA RECOMMENDATIONS 39 VII 2 ANTENNA MATCHING 40 VII 3 ANTENNA TYPES 41 VII 4 EXTERNAL ANTENNA 41 VII 5 EMBEDDABLE ANTENNAS 43 CHAPTER VIII ANNEXES 45 VIII 1 EXAMPLES OF PROPAGATION ATTENUATION 45 ...

Страница 6: ...TION I 1 Aim of the Document The aim of this document is to present the features and the application of the ZE60 2 4 radio module After the introduction the characteristics of the ZE60 2 4 radio module will be described within the following distinct chapters Requirements General Characteristics Technical description Process information Board Mounting Recommendations Antenna Considerations ...

Страница 7: ...the Council 27 January 2003 6 CFR47 Part 15 US FCC Standards for SRD 7 ARIB STD T66 Japan ARIB Standards for SRD 8 Z One Protocol Stack User Guide 1vv0300820 9 2006 771 EC Harmonization of the radio spectrum for use by short range devices 10 2009 381 EC Amending Decision 2006 771 EC on harmonization of the radio spectrum for use by short range devices 11 ZigBee democase User Guide 1vv0300845 12 ZE...

Страница 8: ...ocommunications Committee ESR Equivalent Series Resistance ETR ETSI Technical Report ETSI European Telecommunication Standard Institute FCC Federal Communications Commission IEEE Institute of Electrical and Electronics Engineers ISM Industrial Scientific and Medical KB 1024 bytes 1 byte 8 bits kbps kilobits s LBT Listen Before Talk LNA Low Noise Amplifier MAC Medium Access Control MHz Mega Hertz 1...

Страница 9: ... Maximum radiated power Channel spacing Duty cycle Notes Annex 1h Non Specific Short range Devices 2400 2483 5 MHz 10 mW e i r p No channel spacing specified No restriction Annex 3a Wideband Data Transmission systems 2400 2483 5 MHz 100 mW e i r p and 100 mW 100 kHz e i r p density applies when frequency hopping modulation is used 10 mW MHz e i r p density applies when other types of modulation ar...

Страница 10: ...g in recent years to allow current relaxed regulation Full implementation planned 2012 Italy For private use a general authorization is required if WAS RLAN s are used outside own premises For public use a general authorization is required Luxemburg Implemented General authorization required for network and service supply Norway Implemented This subsection does not apply for the geographical area ...

Страница 11: ...In the United States the FCC is responsible for the regulation of all RF devices Our module intended for unlicensed operation is regulated by CFR 47 Part 15 6 The 2 4 Ghz band used for unlicensed radio equipment is regulated by section 15 247 and 15 249 Japan regulation In Japan the unlicensed use of short range devices in the 2 4Ghz ISM band is regulated by the ARIB standard STD T66 7 ...

Страница 12: ... Z One Protocol Stack user guide 8 for detail information The Z One stack supplies the different libraries allowing the customer to develop its own application software In case the customer needs to develop his own software different tools are available 8051 compiler from IAR http www iar com p882 p882_eng php Z One ZigBee 2007 stack from Telit RF Technologies upon request Z One Protocol Stack Use...

Страница 13: ...Telit Communications S p A written authorization All Rights Reserved page 13 of 45 1vv0300844 Rev 2 24 08 2010 II 4 Temperature Requirements Minimum Typical Maximum Unit Operating Temperature 40 25 85 C Relative humidity 25 C 20 75 Storage Temperature 40 25 85 C ...

Страница 14: ... GENERAL CHARACTERISTICS III 1 Mechanical Characteristics Size Rectangular 26 x 15 mm Height 3 mm Weight 1 7 g PCB thickness 0 8 mm Cover Dimensions 21 x 14 x 2 2mm Thickness 200µm Components All SMD components on one side of the PCB Connectors The terminals allowing conveying I O signals are half moons located around Mounting SMD Half moons on the 4 external sides Number of pins 30 ...

Страница 15: ...ZE60 2 4 RF module User Guide Reproduction forbidden without Telit Communications S p A written authorization All Rights Reserved page 15 of 45 1vv0300844 Rev 2 24 08 2010 III 2 Mechanical dimensions ...

Страница 16: ... All Rights Reserved page 16 of 45 1vv0300844 Rev 2 24 08 2010 III 3 DC Characteristics Characteristics Min Typ Max Power Supply VDD 2 4V 3 0V 3 6V Consumption 3 0V Transmission 140mA Reception 35mA Stand by 32 768 khz On 2µA Sleep wake up on interruption 1µA I O low level GND 0 9 V I O high level VDD 0 7V VDD ...

Страница 17: ...MHz Channel number 16 Channel 11 2405MHz Channel 26 2480MHz Technology DSSS Modulation O QPSK with half sine pulse shaping Radio bit rate 250 kbps Transmit chip rate 2 Mchip s Transmission Min Typ Max Output Power 18dBm 1 dB on the whole band selectable by software Harmonics 2nd harmonic 3rd harmonic 30 dBc 45 dBc Spurious emission 30 1000 MHz 1 12 75 GHz 1 8 1 9 GHz 5 15 5 3 GHz 36 dBm 30 dBm 47 ...

Страница 18: ... adjacent modulated channel 5 MHz for PER 1 47 dB Alternate channel rejection 10 MHz channel spacing Wanted signal 82 dBm adjacent modulated channel 10 MHz for CER 1 47 dB Alternate channel rejection 10 MHz channel spacing Wanted signal 82 dBm adjacent modulated channel 10 MHz for PER 1 Blocking Desensitisation 10MHz 20MHz 50MHz 52 dBm 52 dBm 52 dBm 35 dBm 32 dBm 32 dBm Wanted signal 3 dB above th...

Страница 19: ...Ultra low power voltage detector and µC supervisory circuit Specific signals Serial Tx Rx RTS CTS Inputs Reset Stand By Prog I O 7 I O among those 6 analog inputs with 7 to 12 bits resolution Flashing Through serial Through the air DOTA Download Over The Air functionality Only with Z One Stack Embedded functionality Point to point stack for test purpose ZigBee 2007 stack Z One from Telit upon requ...

Страница 20: ...n The DIP interface version The versions below are considered standard and should be readily available For other versions please contact Telit Please make sure to give the complete part number when ordering Equipment and Part Number SMD Version ZE60 2 4 SMD IA With Integrated Antenna ZE60 2 4 SMD WA Without Integrated Antenna DIP Version ZE60 2 4 DIP IA With Integrated Antenna ZE60 2 4 DIP WA With...

Страница 21: ...e User Guide Reproduction forbidden without Telit Communications S p A written authorization All Rights Reserved page 21 of 45 1vv0300844 Rev 2 24 08 2010 CHAPTER IV TECHNICAL DESCRIPTION IV 1 Pin out of the SMD Module ...

Страница 22: ...GND Gnd Ground J19 TXD O TTL TxD UART Serial Data Transmission J18 STAND_BY I TTL Standby active high J17 GND Gnd Ground J16 PROG I TTL Signal for serial µC flashing active high J15 GND Gnd Ground J14 DEBUG_D I O TTL Debug data J13 GND Gnd Ground J12 GND Gnd Ground J11 GND Gnd Ground J10 DEBUG_C I O TTL Debug clock J9 RESERVED J8 RESERVED J7 IO7_A I O analog Analog Input N 7 Digital I O capability...

Страница 23: ...Guide Reproduction forbidden without Telit Communications S p A written authorization All Rights Reserved page 23 of 45 1vv0300844 Rev 2 24 08 2010 IV 2 Pin out of the DIP Module 67 5 mm 39 6 mm 2 54 mm 32 0 mm mm 35 5 mm 2 0 ...

Страница 24: ...J22 RTS Pin 5 P1_3 Pin 13 J2 CTS Pin J24 CTS Pin 6 P1_2 Pin 14 J2 Reset Pin J23 Reset Pin 10 Reset_N Pin 15 J2 RxD Pin J21 RxD Pin 4 P1_4 Pin 16 J2 TxD Pin J19 TxD Pin 3 P1_5 Pin 17 J2 STAND_BY Pin J18 STAND_BY Pin 1 P1_7 Pin 18 J2 Not connected Pin 19 J2 EA4 Pin J6 IO6_A Pin 16 P0_5 Pin 20 J2 GND GND GND J4 Connector for debugging and programming Pin 1 J4 Pin J14 Debug D Pin 46 P2_1 Pin 2 J4 Pin ...

Страница 25: ...ing data RXD is for incoming data The 1 is represented by a high state CTS 1 Incoming signal Indicates whether the module can send serial data to user Active on low state or not inactive on high state RTS 1 Outgoing signal Indicates whether the user can transmit serial data active on low state or not inactive on high state IO I O configurable as input or as output Available upon request only STAND...

Страница 26: ...1vv0300844 Rev 2 24 08 2010 CHAPTER V PROCESS INFORMATION V 1 Delivery ZE60 2 4 SMD modules are delivered in plastic tray packaging each tray including 50 units The dimensions of the tray are the following 329 mm x 176 mm x 5 6 mm Each unit is placed in a 26 6 mm x 16 mm location An empty tray weights 45 g and a loaded tray weights around 130 g ...

Страница 27: ...ring 24 hours The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect After being submitted to the drying bake tiny modules must be soldered on host boards within 168 hours Also it must be noted that due to some components ZE60 2 4 SMD modules are ESD sensitive device Therefore ESD handling precautions should be carefully observed V 3 Soldering pad p...

Страница 28: ...uthorization All Rights Reserved page 28 of 45 1vv0300844 Rev 2 24 08 2010 The recommended soldering pad layout on the host board for the ZE60 2 4 SMD IA is shown in the diagram below All dimensions in mm Neither via holes nor wires are allowed on the PCB upper layer in area occupied by the module ...

Страница 29: ...oon solder joints see diagram below For proper module assembly solder paste must be printed on the target surface of the host board The solder paste should be eutectic and made of 95 5 of SN 4 of Ag and 0 5 of Cu The recommended solder paste height is 180 μm The following diagram shows mounting characteristics for tiny integration on host PCB V 5 Placement The ZE60 2 4 SMD module can be automatica...

Страница 30: ... 2010 V 6 Soldering profile RoHS process It must be noted that ZE60 2 4 SMD module should not be allowed to be hanging upside down during the reflow operation This means that the module has to be assembled on the side of the printed circuit board that is soldered last The recommendation for lead free solder reflow in IPC JEDEC J STD 020D Standard should be followed ...

Страница 31: ...0844 Rev 2 24 08 2010 The barcode label located on the module shield is able to withstand the reflow temperature CAUTION It must also be noted that if the host board is submitted to a wave soldering after the reflow operation a solder mask must be used in order to protect the tiny radio module s metal shield from being in contact with the solder wave ...

Страница 32: ...es of the ZE60 2 4 module are obtained in a clean noise environment Some basic recommendations must be followed Noisy electronic components serial RS232 DC DC Converter Display Ram bus must be placed as far as possible from the ZE60 2 4 module Switching components circuits especially RS 232 TTL interface circuit power supply must be decoupled with a low ESR 100 µF tantalum capacitor And the decoup...

Страница 33: ... 08 2010 VI 2 Power supply decoupling on ZE60 2 4 module The power supply of ZE60 2 4 module must be nearby decoupled A LC filter must be placed as close as possible to the radio module power supply pin VDD Vdd C1 C2 Power Supply L1 Symbols Reference Value Manufacturer L1 LQH31MN1R0K03 1µH Murata C1 GRM31CF51A226ZE01 22µF Murata C2 Ceramic CMS 25V 100nF Multiple ...

Страница 34: ...th ground plane except in case of integrated antenna no ground plane must be placed in front of the antenna and on the bottom side The radio module ground pin must be connected to solid ground plane If the ground plane is on the bottom side a via Metal hole must be used in front of each ground pad Especially J28 and J30 RF Gnd pins should be grounded via several holes to be located right next to t...

Страница 35: ...the antenna or connector must be 50 ohms following the tables below Ground lines should be connected to the ground plane with as many vias as possible but not too close to the signal line PCB material PCB thickness H mm Coplanar line W mm Coplanar line G mm 0 8 1 0 3 FR4 1 6 1 0 2 Table 1 Values for double face PCB with ground plane around and under coplanar wave guide recommended PCB material PCB...

Страница 36: ...n forbidden without Telit Communications S p A written authorization All Rights Reserved page 36 of 45 1vv0300844 Rev 2 24 08 2010 VI 5 ZE60 2 4 interfacing Example of a full RS 232 connection between a PC or an Automat PLC and ZE60 2 4 SMD WA ...

Страница 37: ...odule User Guide Reproduction forbidden without Telit Communications S p A written authorization All Rights Reserved page 37 of 45 1vv0300844 Rev 2 24 08 2010 Example of a minimum PC connection with ZE60 2 4 SMD IA ...

Страница 38: ...F module User Guide Reproduction forbidden without Telit Communications S p A written authorization All Rights Reserved page 38 of 45 1vv0300844 Rev 2 24 08 2010 Example for sensor connection with ZE60 2 4 SMD IA ...

Страница 39: ...e and its location Particular cautions are required on the following points Use a good and efficient antenna designed for the 2 4 GHz band Antenna must be fixed in such a location that electronic noise cannot affect the performances Outside location is ideal if available Antenna directivity must be low Omni directional antenna is usually the best choice Recommended antenna specifications Frequency...

Страница 40: ... and an antenna Antenna Connection C2 C1 L1 Track 1 Track 2 J29 RF Input Output Symbols Reference Package Value Comments L1 Coil 0603 or 0402 Tbd C1 C2 Capacitor 0603 or 0402 Tbd These values should be measured and optimized with a Network Analyzer If no impedance matching is necessary replace L1 by a 0 Ohm resistor and let C1 and C2 not mounted Track 1 Track 2 Coplanar Waveguide Track 1 length as...

Страница 41: ... be used as long as they are adapted to 2 4 GHz frequency Best range may be achieved if the Wave antenna is placed perpendicular in the middle of a solid ground plane measuring at least 5 cm radius In this case the antenna should be connected to the module via some 50 ohm characteristic impedance coaxial cable Ground plane connected to coaxial ground Wave Antenna connected to hot point Coaxial hot...

Страница 42: ...opole antenna typically offers a ground independent design with favorable gain excellent radiation pattern It has a high impedance and requires an impedance matching circuit See paragraph IX 3 Box WARNING It is recommended to place the wave dipole antenna away from all metallic object which will detuned it Particularity it is not recommended to place this type of antenna directly on a metallic box...

Страница 43: ...s are The radio module must not be placed in a metallic casing or close to metallic devices The internal antenna must be far from noisy electronic Ceramic antenna Ceramic antenna is a SMD component to be mounted directly on the PCB It is designed so that it resonates and be 50 Ohms at the desired frequency But we recommended placing an impedance matching circuit See paragraph IX 3 The place under ...

Страница 44: ...lts from a reference evaluation board of 40x20 mm with a 2 element matching network Matching Network Values Z1 Not necessary Z2 L 3 9 nH Z3 C 1 8 pF Optimal matching network values may vary depending on the antenna environment Frequency range 2 4 2 5 GHz Average Efficiency 45 Peak Gain 0 5 dBi VSWR 2 1 Temperature 40 to 85 C Impedance 50 Ω Unbalanced Dimensions 4 1 L x 2 l x 1 t mm Clearance zone ...

Страница 45: ... 3 dB Thin wall plaster 3 dB 3 4 dB 5 8 dB Medium wall wood 4 6 dB 5 8 dB 10 12 dB Thick wall concrete 5 8 dB 9 11 dB 15 20 dB Armoured wall reinforced concrete 10 12 dB 12 15 dB 20 25 dB Floor or ceiling 5 8 dB 9 11 dB 15 20 dB Armoured floor or ceiling 10 12 dB 12 15 dB 20 25 dB Rain and or Fog 20 25 dB 25 30 dB Attenuations increase along with the frequency In some cases it is therefore difficu...

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