NL865B1 HW Design Guide
1VV0301450 Rev. 1
Page
58
of
72
2017-11-20
NL865B1 Solder reflow
Recommended solder reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak temperature (Tp)
245 +0/-5°C
Time within 5°C of actual peak temperature (tp)
10-30 seconds
Ramp-down rate
6°C/second max.
Time 25°C to peak temperature
8 minutes max.
