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ML865G1 HW Design Guide 

1VV0301632 Rev. 4  

Page 

7

 of 

86 

2020-09-23

 

 

 

External SIM Holder ..................................................................... 55

 

 

ADC Converter ............................................................................. 55

 

5.11.1.

 

Using ADC Converter ................................................................... 56

 

 

Forced USB boot .......................................................................... 56

 

6.

 

RF SECTION ................................................................................ 57

 

 

Bands Variants ............................................................................. 57

 

 

TX Output power .......................................................................... 57

 

 

RX Sensitivity ............................................................................... 57

 

 

Antenna requirements .................................................................. 57

 

6.4.1.

 

PCB Design guidelines ................................................................. 58

 

6.4.2.

 

PCB Guidelines in case of FCC Certification ............................... 60

 

6.4.2.1.

 

Transmission line design .............................................................. 60

 

6.4.2.2.

 

Transmission Line Measurements................................................ 62

 

6.4.2.3.

 

Antenna Installation Guidelines .................................................... 64

 

7.

 

AUDIO SECTION ......................................................................... 65

 

 

Electrical Characteristics .............................................................. 65

 

 

Codec examples ........................................................................... 65

 

8.

 

GNSS SECTION .......................................................................... 66

 

 

GNSS Signals Pin-out .................................................................. 66

 

 

RF Front End Design .................................................................... 66

 

8.2.1.

 

Guidelines of PCB line for GNSS Antenna ................................... 66

 

8.2.2.

 

Hardware-based solution for GNSS and LTE coexistence ........... 67

 

 

GNSS Antenna Requirements ..................................................... 67

 

8.3.1.

 

GNSS Antenna specification ........................................................ 67

 

8.3.2.

 

GNSS Antenna – Installation Guidelines ...................................... 68

 

8.3.3.

 

Powering the External LNA (active antenna) ................................ 68

 

 

GNSS Characteristics .................................................................. 69

 

9.

 

MECHANICAL DESIGN............................................................... 70

 

 

Drawing ........................................................................................ 70

 

10.

 

APPLICATION PCB DESIGN ...................................................... 71

 

 

General ......................................................................................... 71

 

 

Footprint ....................................................................................... 71

 

 

PCB pad design ........................................................................... 73

 

 

PCB pad dimensions .................................................................... 73

 

 

Stencil ........................................................................................... 74

 

 

Solder paste ................................................................................. 75

 

Содержание ML865G1

Страница 1: ...01 2017 Mod 0805 2017 01 Rev 6 ML865G1 HW User Guide 1VV0301632 Rev 4 2020 09 23...

Страница 2: ...r copyrighted material including the exclusive right to copy reproduce in any form distribute and make derivative works of the copyrighted material Accordingly any copyrighted material of Telit and it...

Страница 3: ...ies IV Trademarks TELIT and the Stylized T Logo are registered in Trademark Office All other product or service names are the property of their respective owners V Third Party Rights The software may...

Страница 4: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 4 of 86 2020 09 23 APPLICABILITY TABLE PRODUCTS ML865G1 WW...

Страница 5: ...Third Party Rights 3 APPLICABILITY TABLE 4 CONTENTS 5 1 INTRODUCTION 9 Scope 9 Audience 9 Contact Information Support 9 Text Conventions 10 Related Documents 11 2 GENERAL PRODUCT DESCRIPTION 12 Overv...

Страница 6: ...30 4 3 3 Power Supply PCB layout Guidelines 31 RTC supply 32 VAUX Power Output 32 5 DIGITAL SECTION 34 Logic Levels 34 Power On 35 Auto Power On 38 Power Off 38 Unconditional Shutdown 40 Wake from dee...

Страница 7: ...Antenna Installation Guidelines 64 7 AUDIO SECTION 65 Electrical Characteristics 65 Codec examples 65 8 GNSS SECTION 66 GNSS Signals Pin out 66 RF Front End Design 66 8 2 1 Guidelines of PCB line for...

Страница 8: ...ge 8 of 86 2020 09 23 Solder Reflow 75 11 PACKAGING 77 Tray 77 Reel 79 Moisture sensitivity 79 12 CONFORMITY ASSESSMENT ISSUES 81 ANATEL Regulatory Notices 81 13 SAFETY RECOMMENDATIONS 82 READ CAREFUL...

Страница 9: ...rt For general contact technical support services technical questions and report documentation errors contact Telit Technical Support at TS EMEA telit com TS AMERICAS telit com TS APAC telit com TS SR...

Страница 10: ...lure or bodily injury may occur Caution or Warning Alerts the user to important points about integrating the module if these points are not followed the module and end user equipment may fail or malfu...

Страница 11: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 11 of 86 2020 09 23 Related Documents 80000NT10001A SIM INTEGRATION DESIGN GUIDES Application Note...

Страница 12: ...IOs minimizing power consumption and making it even more ideally suited for battery powered and wearable device applications Product Variants and Frequency Bands Product 2G Band MHz LTE CATM1 NBIoT Re...

Страница 13: ...d user information are required for example Telematics services Road pricing Pay as you drive insurance Stolen vehicles tracking Internet connectivity Main features Function Features Modem CATM NBIoT...

Страница 14: ...865G1 WW Band Mode Class RF power dBm 850 900MHz GPRS 4 32 5 EGPRS E2 27 1800 1900MHz GPRS 1 29 5 EGPRS E2 26 B1 B2 B3 B4 B5 B8 B12 B13 B18 B19 B20 B25 B26 B27 B28 B66 B85 LTE CAT M1 3 23 B1 B2 B3 B4...

Страница 15: ...2 102 7 CAT M1 Band2 107 4 100 3 CAT M1 Band3 106 1 99 3 CAT M1 Band4 107 1 102 3 CAT M1 Band5 106 4 100 8 CAT M1 Band8 105 9 99 8 CAT M1 Band12 103 7 99 3 CAT M1 Band13 107 0 99 3 CAT M1 Band18 107 1...

Страница 16: ...CAT NB2 Band3 116 2 108 2 CAT NB2 Band4 116 0 CAT NB2 Band5 116 0 108 2 CAT NB2 Band8 110 6 108 2 CAT NB2 Band12 115 5 108 2 CAT NB2 Band13 115 9 108 2 CAT NB2 Band18 116 1 108 2 CAT NB2 Band19 115 7...

Страница 17: ...2 6 mm 2 7 2 Weight The nominal weight of the ML865G1 WW is 2 grams Temperature Range Note Operating Temperature Range 40 C to 85 C The module is fully functional and compliant according to regulator...

Страница 18: ...tion has to be paid when comparing with previous 48 pin xL865 FF design Pin out Pin Signal I O Function Type Comment USB HS 2 0 COMMUNICATION PORT 20 USB_D I O USB differential Data 3V 19 USB_D I O US...

Страница 19: ...8V 6 C106 CTS O Output for Clear to send signal CTS to DTE CMOS 1 8V 9 C103 TXD I Serial data input TXD from DTE CMOS 1 8V 10 C104 RXD O Serial data output to DTE CMOS 1 8V SIM card interface 11 SIMV...

Страница 20: ...High 55 HW_SHUTDOWN I UNCONDITIONAL SHUTDOWN VBATT 51 V_AUX PWRMON O 1 8V 56 FORCED_USB_BOOT I CMOS 1 8V 40 ANTENNA I O Antenna pad 50 RF 37 GNSS_ANT I GNSS receiver input 50 RF GPIO 48 GPIO_01 DVI_WA...

Страница 21: ...nfigurable GPIO CMOS 1 8V 30 GPIO_08 I O GPIO08 Configurable GPIO CMOS 1 8V STAT_LED alternate function 29 SPI_CLK I O SPI_CLK CMOS 1 8V Power Supply 44 VBATT Main power supply Baseband Power 43 VBATT...

Страница 22: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 22 of 86 2020 09 23 Reserved 8 RFU 16 RFU 17 RFU 22 RFU 24 RFU 25 RFU 26 RFU 28 RFU 34 RFU 36 RFU 49 RFU 50 RFU...

Страница 23: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 23 of 86 2020 09 23 Pin Layout TOP VIEW The pins defined as NC RFU shall be considered RESERVED and must not be connected to any pin in the application...

Страница 24: ...ower Supply Value Nominal Supply Voltage 3 8V Operating Voltage Range 3 20 V 4 20 V Extended Voltange Range 2 60 V 4 50 V VBATTmin 2 7V CAUTION The range 2 60V 3 20V can be used only if both USB and 2...

Страница 25: ...9 5 9 2 9 0 Normal mode full functionality of the module AT CFUN 4 7 5 Disabled TX and RX module is not registered on the network AT CFUN 5 1 20 0 95 Paging cycle 256 frames 2 56s DRx cycle 0 60 0 60...

Страница 26: ...gy The support of specific network wireless technology depends on product variant configuration PSM MODE Typical mA AT CPS MS 1 3uA No current source or sink by any connected pin Mode Measure Typical...

Страница 27: ...SC RU 32ms TBS 0 BPSK 20dBm Band 71 600 1000 3 75KHz 1 SC RU 32ms TBS 0 BPSK 23dBm Band 85 28 12 500 850 3 75KHz 1 SC RU 32ms TBS 0 BPSK 23dBm Band 13 26 5 18 19 20 8 430 750 3 75KHz 1 SC RU 32ms TBS...

Страница 28: ...4 3 1 1 5V Source Power Supply Design Guidelines The desired output for the power supply is 3 8V hence there s not a big difference between the input source and the desired output and a linear regula...

Страница 29: ...citor of adequate capacity must be provided in order to cut the current absorption peaks a 100 F capacitor is usually suited Make sure the low ESR capacitor on the power supply output is rated at leas...

Страница 30: ...NOTE DON T USE any Ni Cd Ni MH and Pb battery types directly connected with ML865G1 Their use can lead to overvoltage on the ML865G1 and damage it USE ONLY Li Ion battery types 4 3 2 Thermal Design Gu...

Страница 31: ...significant voltage drops occur This is for the same reason as previous point Try to keep this trace as short as possible To reduce the EMI due to switching it is important to keep very small the mesh...

Страница 32: ...and others Pin 51 can be used also as PWRMON module powered ON indication function because is always active when the module is powered ON and cannot be set to LOW level by any AT command Host can only...

Страница 33: ...Design Guide 1VV0301632 Rev 4 Page 33 of 86 2020 09 23 NOTE The Output Current MUST never be exceeded care must be taken when designing the application section to avoid having an excessive current co...

Страница 34: ...essor is intermittently switched ON and AT commands can be processed with some latency ML865G1 is idle with low current consumption Deep sleep mode state PSM defined in 3GPP Release 12 Baseband is swi...

Страница 35: ...t HIGH level for 5 seconds The signal ON_OFF WAKE can be directly connected to any GPIO 1 8V of Application Processor with a totem pole output A level shifter is not required The typical current consu...

Страница 36: ...W Design Guide 1VV0301632 Rev 4 Page 36 of 86 2020 09 23 Modem ON Proc START VBATT VBATTmin ON_OFF HI PWRMON ON Delay 5 sec ON_OFF LOW PWRMON ON Delay 1 sec GO TO Start AT Commands Modem ON Proc END N...

Страница 37: ...In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ML865G1 when the module is powered off or during an ON OFF tra...

Страница 38: ...KE line to power on the module Auto Power On ML865G1 module can be switched on with ON_OFF WAKE pin 7 permanently fixed to HI level 1 8V In the configuration there are two limitations the asynchronous...

Страница 39: ...r to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ML865G1 when the module is powered off or during an ON OFF transition...

Страница 40: ...l this pin on start up To unconditionally shutdown the ML865G1 the pad HW_SHUTDOWN must be tied low for at least 200 milliseconds and then released The signal is internally pulled up so the pin can be...

Страница 41: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 41 of 86 2020 09 23 For example Let us assume you need to drive the HW_SHUTDOWN pad with a totem pole output of a 3 5 V microcontroller...

Страница 42: ...In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ML865G1 when the module is powered off or during an ON OFF tra...

Страница 43: ...gital output Using pull up resistor may bring to latch up problems on the ML865G1 power regulator and improper functioning of the module To proper power on again the module please refer to the related...

Страница 44: ...command 5 7 1 Fast Shut Down by Hardware The Fast Power Down can be triggered by configuration of any GPIO HI level to LOW level transition of GPIO commands fast power down Example circuit NOTE Consi...

Страница 45: ...I O Function NOTE 20 USB_D I O USB differential Data 19 USB_D I O USB differential Data 18 VUSB AI Power sense for the internal USB transceiver Accepted range 3 0V to 5 5V 100K pull down The USB_DPLU...

Страница 46: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 46 of 86 2020 09 23 NOTE Disconnect or assert to GND the VUSB pin before activating the Power Saving Mode...

Страница 47: ...t control The following table is listing the available signals PAD Signal I O Function Type NOTE 29 SPI_CLK I O SPI Clock CMOS 1 8V 52 SPI_MISO I O SPI MISO CMOS 1 8V Shared with RX_AUX 53 SPI_MOSI I...

Страница 48: ...ersal Asynchronous Receive Transmit microcontroller UART 5V or other voltages different from 1 8V Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to...

Страница 49: ...see Note Input receive of the ML865G1 UART 4 C108 DTR 4 Data Terminal Ready Input to the ML865G1 that controls the DTE READY condition 6 C107 DSR 3 Data Set Ready Output from the ML865G1 that indicate...

Страница 50: ...e connected the other lines can be left open provided a software flow control is implemented In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal appl...

Страница 51: ...Change the level from 0 1 8V to 15 15V Actually the RS232 UART 16450 16550 16650 16750 chipsets accept signals with lower levels on the RS232 side EIA TIA 562 allowing a lower voltage multiplying rati...

Страница 52: ...onnected to a DB9 connector with the following layout General purpose I O The ML865G1 module is provided by a set of Configurable Digital Input Output pins CMOS 1 8V Input pads can only be read they r...

Страница 53: ...ing a GPIO as INPUT The GPIO pads when used as inputs can be connected to a digital output of another device and report its status provided this device has interface levels compatible with the 1 8V CM...

Страница 54: ...or compatible hardware When set as outputs the pads have a push pull output and therefore the pull up resistor may be omitted 5 9 3 Indication of network service availability The STAT_LED pin status...

Страница 55: ...calculated taking in account VBATT value and LED type External SIM Holder Please refer to the related User Guide SIM Holder Design Guides 80000NT10001a ADC Converter The ML865G1 is provided by one AD...

Страница 56: ...SB boot In some case of firmware upgrade FORCED_USB_BOOT pin must be set to 1 8V during poweron of ML865G1 The input current is very low so 10K resistor to 1 8V supply can be used to keep this pin in...

Страница 57: ...nts and the guidelines for a proper design The antenna and antenna transmission line on PCB for a Telit ML865G1 WW device shall fulfil the following requirements Item Value Frequency range Depending b...

Страница 58: ...865G1 since there s no antenna connector on the module the antenna must be connected to the ML865G1 antenna pad K1 by means of a transmission line implemented on the PCB This transmission line shall f...

Страница 59: ...ving other signal tracks facing directly the antenna line track Avoid crossing any un shielded transmission line footprint with other signal tracks on different layers The ground surrounding the anten...

Страница 60: ...sign During the design of the ML865G1 interface board the placement of components has been chosen properly in order to keep the line length as short as possible thus leading to lowest power losses pos...

Страница 61: ...th 1 1 mm clearance from coplanar ground plane 0 3 mm each side The line uses reference ground plane on layer 3 while copper is removed from layer 2 underneath the line Height of trace above ground pl...

Страница 62: ...session A calibrated coaxial cable has been soldered at the pad corresponding to RF output a SMA connector has been soldered to the board in order to characterize the losses of the transmission line...

Страница 63: ...VV0301632 Rev 4 Page 63 of 86 2020 09 23 Line input impedance in Smith Chart format once the line has been terminated to 50 load is shown in the following figure Insertion Loss of G CPW line plus SMA...

Страница 64: ...d in Antenna manufacturer documentation It is preferable to get an omnidirectional radiation pattern to Antenna Gain must not exceed values indicated in regulatory requirements where applicable in ord...

Страница 65: ...a one of the several compliant codecs in case an analog audio is needed Electrical Characteristics The product is providing the DVI on the following pins Pin Signal I O Function Type 48 DVI_WA0 O Digi...

Страница 66: ...layer of the PCB used only for the Ground plane if possible Surround on both the sides over and under the antenna line on PCB with Ground avoid having other signal tracks facing directly the antenna...

Страница 67: ...iver from LTE out of band emissions as described in the schematic below When the GNSS receiver embedded in the ML865G1 module is used there is no condition for degradation because LTE part and GNSS pa...

Страница 68: ...ade features like antenna lobes and gain 8 3 3 Powering the External LNA active antenna The LNA of active antenna needs a source of power because 1 8V or 3V DC voltage needed by active antenna is not...

Страница 69: ...86 2020 09 23 GNSS Characteristics The table below specifies the GNSS characteristics and expected performance Parameters Typical Measurement Sensitivity Tracking Sensitivity 159 dBm Navigation 155 dB...

Страница 70: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 70 of 86 2020 09 23 9 MECHANICAL DESIGN Drawing NOTE Dimensions in mm General Tolerance 0 1 Angular Tolerance 1 The tolerance is not cumulative...

Страница 71: ...L865G1 HW Design Guide 1VV0301632 Rev 4 Page 71 of 86 2020 09 23 10 APPLICATION PCB DESIGN General The ML865G1 modules have been designed to be compliant with a standard lead free SMT process Footprin...

Страница 72: ...he application a 1 5 mm placement inhibit area around the module It is also suggested as common rule for an SMT component to avoid having a mechanical part of the application in direct contact with th...

Страница 73: ...mended for the solder pads on the PCB PCB pad dimensions It is not recommended to place via or micro via not covered by solder resist in an area of 0 3 mm around the pads unless it carries the same si...

Страница 74: ...mperatures which are occurring at the lead free process This issue should be discussed with the PCB supplier Generally the wettability of tin lead solder paste on the described surface plating is bett...

Страница 75: ...dules after assembly Solder Reflow Recommended solder reflow profile WARNING The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the m...

Страница 76: ...180 seconds Tsmax to TL Ramp up Rate 3 C second max Time maintained above Temperature TL Time tL 217 C 60 150 seconds Peak Temperature Tp 245 0 5 C Time within 5 C of actual Peak Temperature tp 10 30...

Страница 77: ...ge 77 of 86 2020 09 23 11 PACKAGING Is possible to order in two packaging system Package on tray Package on reel Tray The ML865G1 modules are packaged on trays of 40 pieces each These trays can be use...

Страница 78: ...ML865G1 HW Design Guide 1VV0301632 Rev 4 Page 78 of 86 2020 09 23...

Страница 79: ...es each See figure for module positioning into the carrier Moisture sensitivity The moisture sensitivity level of the Product is 3 according with standard IPC JEDEC J STD 020 take care of all the rela...

Страница 80: ...40 C and 90 RH b Environmental condition during the production 30 C 60 RH according to IPC JEDEC J STD 033B c The maximum time between the opening of the sealed bag and the reflow process must be 168...

Страница 81: ...quipamento n o tem direito prote o contra interfer ncia prejudicial e n o pode causar interfer ncia em sistemas devidamente autorizados This equipment is not entitled to protection against harmful int...

Страница 82: ...arefully the instruction for its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible for the functioning of the final product therefore ca...

Страница 83: ...ss HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access UART Universal Asynchronous Receiver Transmitter HSIC High Speed Inter Chip SIM Subscriber Identification Module SPI Se...

Страница 84: ...uide 1VV0301632 Rev 4 Page 84 of 86 2020 09 23 SRDY Slave Ready CS Chip Select RTC Real Time Clock PCB Printed Circuit Board ESR Equivalent Series Resistance VSWR Voltage Standing Wave Radio VNA Vecto...

Страница 85: ...5 8 4 2 has been changed from Modem serial port 2 in Modem serial port 2 USIF1 The title of chapter 5 8 4 1 has been changed from Modem serial port 1 in Modem serial port 1 USIF0 2 2020 07 01 Power c...

Страница 86: ...01 2017 Mod 0805 2017 01 Rev 6...

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