ME910C1 mPCIe HW Design Guide
1VV0301642 Rev. 2
Page 19 of 56
2022-01-14
Not Subject to NDA
The area that the thermal pad is attached to on the application board must be designed
as a large ground pad (with the solder mask exposed).
Note: The average consumption during transmissions depends on
the input voltage and the power level at which the device is requested
to transmit by the network. The average current consumption hence
varies significantly.
4.3.3.
Power Supply PCB Layout Guidelines
Some ME910X1 versions have GSM capabilities. The GSM system is designed in such a
way that the RF transmission is not continuous, otherwise it is packed into bursts at a
base frequency of about 216 Hz, and the related current peaks can be as high as about
2.4A. The average current should be considered 1A. Therefore the power supply must be
designed in order to withstand with these current peaks and average without large
voltage drops; this means that both the electrical design and the board layout must be
designed for this current flow. If the voltage drop during the peak current absorption is
too high, the device may even shutdown due to the input supply voltage drop.
Note: The electrical design for the Power supply should be made so
that it is capable of a peak current output of at least 2.4 A.
As seen on the electrical design guidelines the power supply shall have a low ESR
capacitor on the output to help during the current peaks and protect the supply, especially
DC/DC, from positive and negative spikes. Negative spikes can demage the module. The
placement of this component is crucial for the correct functioning of the circuitry. A
misplaced component can be useless or can even decrease the power supply
performances.
•
The Bypass low ESR capacitor must be placed close to the Telit ME910X1-mPCIe
power input pads or in the case the power supply is a switching type it can be
placed close to the inductor to cut the ripple provided the PCB trace from the
capacitor to the ME910X1-mPCIE is wide enough to ensure a dropless connection
even during the 2A current peaks.
•
A protection diode must be placed close to the input connector where the power
source is drained.
•
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure that no voltage drops occurs when a 2A current peak is
absorbed.
Содержание ME910X1
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