GE9
GE9
GE9
GE910 Hardware User Guide
10 Hardware User Guide
10 Hardware User Guide
10 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 62 of 73
Mod. 0805 2011-07 Rev.2
Profile Feature
Profile Feature
Profile Feature
Profile Feature
Pb
Pb
Pb
Pb----Free Ass
Free Ass
Free Ass
Free Assembly
embly
embly
embly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature (ttp)
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body surface
WARNING:
The GL865 module withstands one reflow process only.