Telit Wireless Solutions GE310-GNSS, Руководство по конструкции

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SIM Integration Design Guide
80000NT10001A Rev. 15 Page 15 of 32 2021-01-29
Not Subject to NDA
Furthermore if the SIM On Chip is shielded inside the application box and cannot be subject to
ESD discharges, the ESD protections can be omitted.
If there is the need to have both a SIM On Chip and a backup SIM Holder, then a dual SIM
approach can be followed and the connections shall be the same as for chapter 5.