Telit GE864 and GC864
Product Description
80273ST10008A Rev. 3 - 10/02/06
Reproduction forbidden without DAI Telecom written authorization – All Right reserved – Right of modification reserved
page 33 of 72
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
2.20.5 Solder
paste
Lead free
Solder paste
Sn/Ag/Cu
2.20.6
GE864 Solder reflow
The following is the recommended solder reflow profile