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HW Design Guide Template
1VV0301651 Rev. 0
Page
11
of
25
2020-02-28
FN980m TLB
Information – There is the TIM on the TLB to transfer the heat
generated by FN980m.
There are the large solder resist opening area on the bottom of
FN980m for the better heat dissipation.
Adding a thermal TIM on the back of FN980m is the most important
thing in thermal dissipation point of view.
With this action, the temerature of FN980m can be decreased
significantly.
Содержание FN980m TLB
Страница 1: ... 01 2017 Mod 0818 2017 01 Rev 0 FN980m TLB HW Design Guide 1VV0301651 Rev 0 2020 02 28 ...
Страница 4: ...HW Design Guide Template 1VV0301651 Rev 0 Page 4 of 25 2020 02 28 APPLICABILITY TABLE PRODUCTS FN980m ...
Страница 14: ...HW Design Guide Template 1VV0301651 Rev 0 Page 14 of 25 2020 02 28 ...
Страница 18: ...HW Design Guide Template 1VV0301651 Rev 0 Page 18 of 25 2020 02 28 Component Diagram Bottom View ...
Страница 19: ...HW Design Guide Template 1VV0301651 Rev 0 Page 19 of 25 2020 02 28 4 SCHEMATICS ...
Страница 20: ...HW Design Guide Template 1VV0301651 Rev 0 Page 20 of 25 2020 02 28 ...
Страница 25: ... 01 2017 Mod 0818 2017 01 Rev 0 ...