(5)
While pressing on the tray, push the fastening toward the LOCK arrow so that the card is securely held.
Fig. 11:
Instructions on how to insert the SIM in the internal tray
2.2.3 Closing the device
After installing the SIM card, you can then close the device. To do this, carry out the steps used to open the device in
reverse order paying special attention to communication modules’ Thermal Pad.
This element must be placed over the communication modules to expel the heat from the module outside (through
the device metal casing). The module should be in contact with the casing.
This pad quite often sticks to the casing when you open up the device. This is due to its rubbery consistency, as no
adhesive is used.
To assemble the device again, you need to carry out the following steps:
(1)
Check that the Thermal Pad is located on top of the module. If it isn’t, check if it’s stuck to the casing. If it is, re-
move it from the casing and place it on top of the module.
(2)
Refit the lid, first sliding it horizontally and then vertically so as not to ‘drag’ it over the pad.
(3)
Replace the seven screws holding the cover.
Fig. 12:
Example of a Thermal Pad assembled over the WWAN MD1. This must be assembled in both.
Teldat S.A.
2 Installation
Teldat H2 RAIL Lite
11