Tektronix P6450, Инструкция по эксплуатации

Страница: 14 / 51

Preface
Commonly Used Terms
Refer to the following list of commonly used terms throughout the manual.
cLGA An acronym for compression Land Grid Array, a connector that provides an
electrical connection between a PCB and the probe input circuitry.
Compression Footprint
A connectorless, solderless contact between your PCB and the P6450 probes.
Connection is obtained by applying pressure between your PCB and the probe
through a cLGA c-spring.
D-Max probing technology The name that describes the technology used in the P6450 high-density logic
analyzer probe.
Flying Lead Set A lead set designed to attach to a P6450 probe to provide general-purpose probing
capability. (See Figure i.)
Figure i: Flying lead set
Functional Check
Procedure
Functional check procedures verify the basic functionality of the probes by
con
fi rming that the probes recognize signal activity at the probe tips.
Keepout Area
An area on a printed circuit board in which component, trace, and/or via placement
may be restricted.
Module The unit that plugs into a mainframe that provides instrument capabilities such
as logic analysis.
x P6450 High-Density Logic Analyzer Probe Instruction Manual