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TDK-Lambda
CN-A110 Series
Instruction Manual
2. Heatsink Installation Method
(1) Method of Fixing Heatsink
To fix the heatsink onto power module, use M3 screws and
mount it to the M3 threaded holes (2 places or 4 places
depending on the package size) at the baseplate side.
Recommended torque is 0.54 N∙m.
Use silicone grease or thermal conductive sheet in between
heatsink and baseplate to minimize the contact thermal
resistance and to enhance the heat conductivity.
Also use the no-warped heatsink and make sure good
contact between baseplate and heatsink.
(2) Mounting Hole of Heatsink
Recommended mounting hole is as follows.
φ
3.5 Non-threaded hole
3. Regarding Vibration
The vibration specification of the module is determined
assuming that only the power module is mounted on printed
circuit board. To prevent excessive force to the module and the
printed circuit board, fix the heatsink to the chassis as well as
to the module when a large size of heatsink is used.
4. Recommended Soldering Conditon
Recommended soldering conditions are as follows.
(1) Soldering dip
Dip condition : 260ºC within 10 seconds
Pre-heat condition : 110ºC for 30 - 40 seconds
(2) Soldering iron
350ºC within 3 seconds
※
Soldering time changes according to heat capacity of
soldering iron, pattern on printed circuit board, etc. Please
confirm actual performance.
5. Recommended Cleaning Condition
Recommended cleaning condition after soldering is as
follows.
(1) Cleaning solvent
IPA (isopropyl alcohol )
(2) Cleaning Procedure
Use brush and dry the solvent completely.
