TDK-Lambda
10/11
5. Soldering Conditions / Cleaning Conditions / Installation Method
5-1 Soldering Conditions
【DIP Model】
Perform soldering of the converter to the board according to the conditions shown in Table 5-1.
Soldering is to be performed only one time per pin.
Table 5-1 Solder Conditions for DIP Models
Method
Condition
Solder Dip
260℃ 10 sec Max.
Solder Iron
380℃ 3 sec Max.
【SMD Model】
Lead free solder / high temperature reflow process conditions are shown in Figure 5-1.
The number of times permitted for reflow is 1 time.
TP
225
Ty2
Ty1
部
品
表
面
温
度
(
℃
)
ハンダ付け時間(s)
A '
A
B
B '
C
A
A '
B
B '
C
1.0~3.0℃/sec
Ty1:150±10℃
Ty2:170±10℃
Ty1~Ty2:20~100sec
1.0~4.0℃/sec
TP:MAX 245℃
225℃以上:20~40sec
-1.0~-5.0℃/sec
Fig. 5-1 Reflow Process Conditions for SMD Models
5-2 Washing Conditions
It is recommended not to clean the board after soldering.
If cleaning is required, brush only the terminals so that the cleaning liquid does not adhere to the product.
Then, dry up thoroughly after washing.