L2 Repair Enhance Document
TCL
Communication Ltd.
Rev.
Neon PRD62980/62981 L2 Enhance Repair Document
Page
1.0
54/69
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7.2 Trouble shootings for common failures
NOTE:
1) Because the PCBA will become damp after long time storage, please use oven to bake the main PCBA
firstly if it has been stored for more than 7days (oven temperature: 105
℃
, Time: >8H). Otherwise it may
cause the PCBA blister easily when you heat part of the PCBA by using hot wind gun.
2) Interchange method means using a new component to test the function in order to verify whether the
old component is defected.
