TCL Alcatel 4017A, Руководство по ремонту, Страница: 3 / 54

L2E Repair Document
TCL
Communication Ltd.
Rev.
4017A_D_E_F_X_S Level 2 enhance Repair Document
Page
1.0 3/54
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Content
1 Level 2 enhance repair process ............................................................................... 4
2 Warranty Check and Visual Inspection ................................................................... 5
2.1 Warranty confirmation of L1..................................................................................... 5
2.2 Visual mechanical check .......................................................................................... 6
2.3 Pretest ........................................................................................................................ 7
2.5 Accessories inspection ............................................................................................ 8
2.6 Cell phone maintenance procedure ........................................................................ 9
3 Software download ................................................................................................. 15
3.1 Equipments requested when download
：
............................................................
16
3.2 Install driver ............................................................................................................. 16
3.3 SW download process ............................................................................................ 17
5 Disassembly and assembly 4017 ........................................................................... 21
5.1 ESD Safety ............................................................................................................... 21
5.2 Disassembly tool ..................................................................................................... 21
5.3 Disassembly process ............................................................................................. 22
5.4 Reassembly Process .............................................................................................. 29
5.5 Disassembly process evaluation ........................................................................... 30
6 Disassembly Complete ........................................................................................... 31
7 Level 2 repair ........................................................................................................... 33
8 L2 Enhance repair ................................................................................................... 41
8.1 Position of L2 enhance components on main PCBA ........................................... 41
8.2 Trouble shooting for common failures .................................................................. 43
8.3 L2 enhance spare part list ...................................................................................... 52
9 PCBA exchange ....................................................................................................... 52
10 Other component exchange ................................................................................... 53
11 Final test .................................................................................................................. 54