L2 Repair Document
TCL
Communication Ltd.
Rev.
5056O
Level 2 Repair Document
Page
1.0
3/60
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Content
1
Level 2E repair process ............................................................................................ 4
2
Warranty Check and Visual Inspection ................................................................... 5
2.1
Warranty confirmation of L1 ..................................................................................... 5
2.2
Visual mechanical check .......................................................................................... 6
2.3
Pretest ........................................................................................................................ 7
3
Battery ...................................................................................................................... 12
3.1
Battery information ................................................................................................. 12
3.2
Battery test .............................................................................................................. 14
3.3
Battery specification ............................................................................................... 16
3.4
WARNING of Battery disassembling ..................................................................... 17
4
Software download ................................................................................................. 18
4.1. Equipments requested when download
：
............................................................ 18
4.2. Handset driver installation ..................................................................................... 18
4.3. SW download process ............................................................................................ 19
5 Disassembly and assembly 5056O ............................................................................ 22
5.1 ESD Safety ............................................................................................................... 22
5.2 Disassembly tool ..................................................................................................... 22
5.3 Disassembly process ............................................................................................... 22
6
Level 2 repair ........................................................................................................... 22
5.4 Reassembly process ................................................................................................ 30
5.5 Disassembly process evaluation ............................................................................ 31
7
Disassembly Complete ........................................................................................... 31
8
L2 Enhance repair ................................................................................................... 40
8.1
Position of L2 enhance components on PCBA .................................................... 41
8.2
Trouble shooting for common failures .................................................................. 42
8.3
L2 enhance spare part list ...................................................................................... 54
9
PCBA exchange ....................................................................................................... 54
10
Other component exchange ................................................................................... 54
10
Function test ............................................................................................................ 55
