Taoglas PA.11, Техническое описание, Страница: 17 / 19

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SPE-11-8-091-D
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1. Time shown in the above figures is measured from the point when chip surface reaches temperature.
2. Temperature difference in high temperature part should be within 110°C.
3. After soldering, do not force cool, allow the parts to cool gradually.
General attention to soldering
●
High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence
strength, and the change of characteristic may occur.
● For soldering, please refer to the soldering curves above. However, please keep exposure to temperatures exceeding
200°C to under 50 seconds.
● Please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water soluble, be sure to wash thoroughly
to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause
cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below.
Frequency: 40kHz
Output Power: 20W
Cleaning Time: 5 minutes max
10. Recommended Reflow Temperature Profile
4. Antenna Radiation Patterns 3. Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns 3. Antenna
Characteristics
4. Antenna Radiation Patterns 3. Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns 3. Antenna
Characteristics
4. Antenna Radiation Patterns 3. Antenna
Characteristics