To set details of optional device
204
Chapter 8
2-2.
Sequin device IV
The detail of the device will be set.
2-2-1.
Screen
[a]
Feed amount of sequin chips of device at left side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[b]
Feed amount of sequin chips of the device at the right side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[c]
Insertion of jump data when a sequin chip is sewn on
Select "YES" when sequin chips are not sewn effectually. However, productivity will be
decreased.
YES: To perform
NO: Not to perform
[d]
Moving up of device at frame stepping
YES: To perform
NO: Not to perform
[e]
Feed out the sequin chip one by one manually.(
The feed amount is the value selected at [a] or [b] described above.
L: Left device
R: Right device
Selecting "NO" will increase manufacturing efficiency. However, the device
could interfere with the frame resulting in its breakage depending on design or
frame type to use.
F3
2 Sequin
NO
YES/NO
Jump Insertion
YES
Device Up at
YES/NO
4.0
4.0
Sequin (L)
Sequin (R)
[mm]
2.0 23.0
[mm]
2.0 23.0
[a]
[b]
[c]
[d]
Sequin chip
feed
[e]
frame stepping
CAUTION
!
Содержание TFMX-IIC
Страница 2: ...TISM...
Страница 14: ...To search from the menu key...
Страница 39: ...25 1 2 3 4 5 6 7 8 9 10 11 Chapter 3 Screen 1 Screen display 26 2 Message display 31...
Страница 90: ...Embroidery starts 76 Chapter 4...
Страница 158: ...Functions that must be remembered 144 Chapter 5...
Страница 202: ...Design saved in USB memory 188 Chapter 7...
Страница 213: ...To make optional device available for use 199 Chapter 8 1 2 3 4 5 6 7 8 9 10 11 2 To use Bobbin changer YES 6 7 6 7...
Страница 226: ...Functions concerning optional device 212 Chapter 8...
Страница 250: ...236 Inspection Repair Chapter 10...
Страница 266: ...Index...
Страница 267: ...1st Edition June 2004 47th Edition April 2020...
Страница 268: ......